Different components with various models or specifications in the design.

This refers to Surface Mount Devices (SMDs), not the number of placements or through-hole components per board. These components are directly soldered onto the surface of the PCB rather than being inserted through holes.

Panelizing identical PCBs into a larger sheet increases both PCB production and SMT assembly efficiency. It is generally recommended to panelize boards smaller than 5*5 cm.

Single Pieces: This means that the file you uploaded has already been panelized, and we will manufacture according to the provided file.

Panelized Board: This means that the file you uploaded contains individual boards, and Ovaga will handle the panelization. The panelization method can either be specified by you or Ovaga can offer a suitable recommendation.

Please select whether the PCB has single-sided SMT placement or double-sided SMT placement.

This refers to electronic components that need to be inserted through holes in the PCB and soldered on the backside or bottom layer.

This refers to loading the original program, after compilation, into the product or a specific component using software or tools.

Conformal coating has excellent resistance to high and low temperatures. Once cured, it forms a transparent protective layer with superior insulation, moisture resistance, protection against electrical leakage, vibration, dust, corrosion, aging, and corona resistance.

Standard Cleaning: During the PCBA DIP process, the no-clean flux residue from wave soldering is acceptable. Wave soldering may leave a hazy trace, which is in line with standard appearance requirements. During manufacturing, soldering iron use for repair, soldering, or rework requires flux to be cleaned. This may leave water-like streaks and residual cleaning agent marks, with a sticky feel in the short term.

Precision Cleaning: This applies when the customer requires bare PCBAs to be shipped without further assembly or when the customer has higher cleanliness standards beyond the normal appearance requirements.

The leaded process refers to the use of leaded solder during SMT and DIP production. If the product must comply with RoHS environmental standards, the lead-free process must be used.