BAV70-7-F

Teilpunkte

• The BAV70-7-F is a diode chip designed for high-speed switching applications in electronic circuits. It consists of two diodes in a common cathode configuration, making it suitable for use in rectification, signal demodulation, and voltage clamping applications. It has a maximum forward voltage of 600 mV and a peak reverse voltage of 70 V, making it ideal for low voltage applications.

• Equivalent

  The equivalent products of BAV70-7-F chip are BAV70, BAV70-13-F, BAV71, and BAV72. These are all small signal diodes that are commonly used in various electronic applications for signal switching, clipping, and high-speed rectification.

• Features

  1. Dual surface mount fast switching diodes 2. Low leakage current 3. High breakdown voltage 4. Low forward voltage drop 5. High switching speed 6. SOT-23 package 7. Ideal for high-speed switching applications 8. RoHS compliant 9. Available in tape and reel packaging 10. Operating temperature range of -55°C to +150°C.

• Pinout

  The BAV70-7-F is a dual surface-mount switch diode with a pin count of 3. Pin 1 is the anode of diode 1, pin 2 is the common cathode, and pin 3 is the anode of diode 2. It is commonly used in high-speed switching applications, voltage clamping, and RF applications.

• Manufacturer

  BAV70-7-F is a product manufactured by Diodes Incorporated. They are a leading global manufacturer and supplier of high-quality semiconductor products for consumer electronics, computing, communications, and industrial applications. Diodes Incorporated specializes in producing diodes, rectifiers, transistors, MOSFETs, voltage regulators, and other discrete semiconductor components.

• Application Field

  BAV70-7-F is commonly used in high-speed switching applications, such as pulse circuits, RF applications, and general-purpose diode applications. It is also utilized in signal processing, voltage rectification, and low power rectification. Additionally, BAV70-7-F can be utilized in instrumentation, telecommunications, consumer electronics, and power management systems.

• Package

  The BAV70-7-F chip is a surface mount DO-214AC package type, with a form of cut tape and reel. It is a SOT-23-3 package size, measuring 2.9mm x 1.3mm x 1.3mm.