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$5000
Altera EP2AGX45DF29C6N
Programmable gate array for flexible and scalable circuit design with 364 IOs
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Marken: Altera Corporation (Intel)
Herstellerteil #: EP2AGX45DF29C6N
Datenblatt: EP2AGX45DF29C6N Datenblatt (PDF)
Paket/Gehäuse: FBGA-780
RoHS-Status:
Lagerzustand: 2.134 Stück, Neues Original
Produktart: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
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*Alle Preise sind in USD
Menge | Einzelpreis | Ext. Preis |
---|---|---|
1 | $416,167 | $416,167 |
200 | $161,051 | $32210,200 |
500 | $155,392 | $77696,000 |
1000 | $152,594 | $152594,000 |
Auf Lager: 2.134 Stck
EP2AGX45DF29C6N Allgemeine Beschreibung
In conclusion, the EP2AGX45DF29C6N FPGA from Intel represents a superior choice for those seeking a powerful, adaptable, and efficient solution for their FPGA needs. With its extensive capabilities, including a high number of logic elements, substantial RAM, embedded multipliers, and support for high-speed transceivers, this FPGA is well-equipped to handle demanding applications across various industries. Its ease of programmability using Intel's Quartus Prime software, coupled with its support for multiple communication interfaces, further solidifies its position as a versatile and reliable FPGA option for diverse projects and applications
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Funktionen
- Device family: Arria II GX
- Device density: 45,152 logic elements (LEs)
- Total RAM: 1,562 Kbits
- Total DSP blocks: 288
- Transceiver count: 24
- Maximum user I/O pins: 622
- Operating speed: up to 500 MHz
- Configuration: Dual configuration with remote update support
- Package: 780-pin FineLine BGA (Ball Grid Array)
Anwendung
- High-performance digital signal processing (DSP) applications
- Wireless communication systems
- Broadcast and professional video processing
- Industrial automation and control
- Test and measurement equipment
- Military and aerospace systems
- Medical imaging and instrumentation
- Networking and data center applications
![Altera Corporation (Intel) Inventory Altera Corporation (Intel) Inventory](/files/uploads/inventory/altera/altera.jpg)
Spezifikationen
Parameter | Wert | Parameter | Wert |
---|---|---|---|
feature-family-name | Arria® II GX | feature-process-technology | 40nm |
feature-maximum-number-of-user-i-os | 364 | feature-number-of-registers | |
feature-device-logic-cells | 42959 | feature-device-system-gates | |
feature-number-of-multipliers | 232 (18x18) | feature-program-memory-type | SRAM |
feature-ram-bits-kbit | 3435 | feature-total-number-of-block-ram | 319 |
feature-ethernet-macs | 1 | feature-supported-ip-core | 10/100/1000Mbps Full Duplex Ethernet MAC|Hashing IP Core (BA413)|IP Compiler for PCI Express x8 (Soft IP)|10/100/1G Ethernet MACController (GMAC)|Video LVDS SerDes Transmitter / Receiver |
feature-supported-ip-core-manufacture | Microtronix Inc/Mobiveil, Inc/CAST, Inc/Barco Silex/MorethanIP | feature-maximum-number-of-serdes-channels | 28 |
feature-device-logic-units | 42959 | feature-device-number-of-dlls-plls | 4 |
feature-transceiver-blocks | 8 | feature-transceiver-speed-gbps | 6.375 |
feature-dedicated-dsp | 29 | feature-pci-blocks | 1 |
feature-programmability | Yes | feature-maximum-internal-frequency-mhz | 400 |
feature-speed-grade | 6 | feature-giga-multiply-accumulates-per-second | |
feature-differential-i-o-standards-supported | HSTL-12|HSTL-15|HSTL-18|LVDS|LVPECL | feature-single-ended-i-o-standards-supported | LVCMOS|LVTTL |
feature-external-memory-interface | QDRII+SRAM|RLDRAM II|DDR3 SDRAM|DDR2 SDRAM|DDR SDRAM | feature-minimum-operating-supply-voltage-v | 0.87 |
feature-maximum-operating-supply-voltage-v | 0.93 | feature-packaging | |
feature-rohs | feature-rad-hard | ||
feature-pin-count | 780 | feature-supplier-package | FC-FBGA |
feature-standard-package-name1 | BGA | feature-cecc-qualified | No |
feature-esd-protection | feature-escc-qualified | ||
feature-military | No | feature-aec-qualified | No |
feature-aec-qualified-number | feature-auto-motive | No | |
feature-p-pap | No | feature-eccn-code | 3A991 |
feature-svhc |
Versand
Versandart | Versandgebühr | Vorlaufzeit | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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REGISTRIERTE LUFTPOST | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
Bearbeitungszeit: Die Versandkosten hängen von der jeweiligen Zone und dem Land ab.
Zahlung
Zahlungsbedingungen | Handgebühr | |
---|---|---|
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Banküberweisung | Bankgebühr in Höhe von 30,00 USD wird berechnet. |
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Paypal | 4,0 % Servicegebühr wird berechnet. |
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Kreditkarte | 3,5 % Servicegebühr wird berechnet. |
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Western Union | charge US.00 banking fee. |
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Geldgramm | Bankgebühr in Höhe von 0,00 USD wird berechnet. |
Garantien
1. Die von Ihnen gekauften elektronischen Bauteile enthalten eine 365-tägige Garantie. Wir garantieren die Produktqualität.
2. Wenn einige der Artikel, die Sie erhalten haben, nicht von perfekter Qualität sind, würden wir verantwortungsvoll Ihre Rückerstattung oder Ersatz arrangieren. Die Artikel müssen jedoch in ihrem Originalzustand verbleiben.
Verpackung
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Schritt1 :Produkt
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Schritt2 :Vakuumverpackung
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Schritt3 :Antistatikbeutel
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Schritt4 :Individuelle Verpackung
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Schritt5 :Verpackungskartons
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Schritt6 :Barcode-Versandetikett
Alle Produkte werden in antistatischen Beuteln verpackt. Versand mit ESD-Antistatikschutz.
Auf dem äußeren ESD-Verpackungsetikett werden die Informationen unseres Unternehmens verwendet: Teilenummer, Marke und Menge.
Wir prüfen alle Waren vor dem Versand, stellen sicher, dass sich alle Produkte in gutem Zustand befinden und dass die Teile neu und original sind und mit dem Datenblatt übereinstimmen.
Nachdem alle Waren darauf überprüft wurden, dass nach dem Verpacken keine Probleme auftreten, werden wir sicher verpacken und per Global Express versenden. Es zeigt eine ausgezeichnete Durchstoß- und Reißfestigkeit sowie eine gute Dichtungsintegrität.
Teilpunkte
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The EP2AGX45DF29C6N chip is a high-performance field-programmable gate array (FPGA) manufactured by Intel (formerly Altera). It belongs to the Arria II GX family of FPGAs and offers a range of features like high-speed transceivers, memory interfaces, and digital signal processing (DSP) blocks. It is suitable for a variety of applications, including communications, video processing, and high-speed data processing.
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Equivalent
There are no direct equivalent products to the EP2AGX45DF29C6N chip. Each chip has its own set of unique features and specifications, making it difficult to find a direct replacement. However, you may consider looking for alternative chips from the same manufacturer or exploring other options within the same performance range. -
Features
EP2AGX45DF29C6N is a high-performance field-programmable gate array (FPGA) with a capacity of 45,036 logic elements. It features a 1.5V core voltage, a maximum clock frequency of 300MHz, and supports various memory interfaces such as DDR3, DDR2, and QDRII+. This FPGA also has built-in DSP blocks and high-speed transceivers for communication applications. -
Pinout
The EP2AGX45DF29C6N is an FPGA (Field Programmable Gate Array) device. It has 29,440 LEs (logic elements) and 1.43 Mbits of embedded memory. The pin count and functions of the EP2AGX45DF29C6N can vary depending on the specific packaging option chosen, as well as the device family and variant. Therefore, it is necessary to refer to the datasheet for the specific pin count and function details. -
Manufacturer
The manufacturer of the EP2AGX45DF29C6N is Intel Corporation. It is an American multinational technology company that designs, manufactures, and sells computer components, including programmable logic devices like the EP2AGX45DF29C6N. Intel is widely recognized for its processors and other semiconductor products used in various industries. -
Application Field
The EP2AGX45DF29C6N is a field-programmable gate array (FPGA) that can be used in a variety of applications such as telecommunications, industrial automation, high-performance computing, and military and aerospace systems. With its high processing power and flexible programmability, it can be tailored to meet the specific requirements of these different application areas. -
Package
The EP2AGX45DF29C6N chip comes in a Ball Grid Array (BGA) package type with a 29mm x 29mm form factor.
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