Altera EPM2210F256C4N

Teilpunkte

• The EPM2210F256C4N is a programmable logic device designed by Intel. It belongs to the MAX II CPLD family and offers 2,210 logic elements, 4 input/output banks, and 40 user I/O pins. It is widely used in applications that require low-cost, low-power programmable logic solutions. The chip provides reliable performance and is well suited for various industrial, automotive, and consumer electronics applications.

• Equivalent

  There are no direct equivalent products of the EPM2210F256C4N chip. However, similar products in Altera/Intel's MAX II CPLD series with similar specifications and features can be considered as alternatives, such as the EPM240T100C5N or EPM570T100C5N.

• Features

  The EPM2210F256C4N is an embedded system that features a 256KB flash memory, ideal for data storage. It also includes 48 programmable logic array blocks (LABs) for flexible design and implementation. With its 288 logic elements (LEs), it offers a high-performance solution for various applications.

• Pinout

  The EPM2210F256C4N is an FPGA IC with a pin count of 256. It is a high-density device designed for applications that require advanced bus interface capability. The specific pin functions vary depending on the design and application, but generally include input/output, clocks, power, and configuration pins.

• Manufacturer

  The manufacturer of the EPM2210F256C4N is Intel FPGA, which is a leading semiconductor company specializing in field-programmable gate arrays (FPGAs). Intel FPGA provides hardware programmable solutions that enable customers to integrate custom logic, accelerate performance, and optimize power consumption in a wide range of applications such as data centers, automotive systems, and industrial automation.

• Application Field

  The EPM2210F256C4N is a Field Programmable Gate Array (FPGA) chip designed by Altera. It can be used in various application areas such as communications, aerospace, defense, automotive, industrial automation, and medical equipment. This FPGA offers high performance, low power consumption, and flexibility, making it a suitable choice for a wide range of applications.

• Package

  The package type of the EPM2210F256C4N chip is FBGA (Fine-Pitch Ball Grid Array). Its form is 256-BGA and its size is 17mm x 17mm.