LITEON MOC3063

Teilpunkte

• The MOC3063 chip is a zero-crossing triac driver optocoupler. It is used to isolate low-voltage control signal inputs from high-voltage power circuits in applications such as motor control, lamp dimming, and switching high-power loads. By providing electrical isolation and zero-crossing detection, the chip ensures efficient and safe control of AC currents while minimizing noise and interference.

• Equivalent

  The equivalent products of the MOC3063 chip are the MOC3061 and MOC3062 chips. They all belong to the same series of optoisolators with similar specifications and functionality.

• Features

  The MOC3063 is an optically isolated triac driver. Its features include a peak blocking voltage of 400V, continuous load current of 0.6A, input current of 15mA, and an LED trigger current of 5mA. It has a low triggering current, high breakdown voltage, and isolation voltage of 5300Vrms, making it suitable for various control applications.

• Pinout

  The MOC3063 is a 6-pin optocoupler, also known as a solid-state relay. The pin-out is as follows: Pin 1 - Input Anode, Pin 2 - Input Cathode, Pin 3 - NC (No Connection), Pin 4 - Output Cathode, Pin 5 - Output Anode, Pin 6 - NC (No Connection). Its function is to isolate and control high-voltage AC loads using a low-voltage DC input.

• Manufacturer

  The MOC3063 is manufactured by Fairchild Semiconductor, a company known for producing a wide range of semiconductors and integrated circuits. Specializing in power management and analog components, Fairchild Semiconductor is a global supplier in the electronics industry, catering to various sectors including automotive, industrial, consumer electronics, and telecommunications.

• Application Field

  The MOC3063 is commonly used in applications such as solid-state relays, motor control circuits, programmable logic controllers, and electric vehicle charging systems. It is specifically designed for interfacing between low voltage control signals and high voltage loads, providing optically isolated switching capabilities.

• Package

  The MOC3063 chip is available in a DIP-6 package type, with a through-hole form and a compact size.