Infineon S6J336CHTBSC20000

Teilpunkte

• The S6J336CHTBSC20000 chip is a microcontroller designed by Renesas Electronics Corp. It features a high-performance ARM Cortex-R5 core, suitable for applications such as automotive engine control units. It also includes various peripherals, such as timers, ADCs, and communication interfaces, making it a versatile solution for a range of automotive applications.

• Equivalent

  Some equivalent products to the S6J336CHTBSC20000 chip are the Infineon Technologies XMC1300, STMicroelectronics STM32F0, and Microchip ATSAMC21. These microcontrollers offer similar functionality and features, making them suitable alternatives for certain applications.

• Features

  1. Arm Cortex-M3 core 2. 32-bit RISC architecture 3. Clock frequency up to 160 MHz 4. Flash memory capacity up to 2 MB 5. High-speed USB interface 6. Multiple communication interfaces (SPI, I2C, UART) 7. Integrated analog peripherals (ADC, DAC) 8. Low power consumption for energy efficiency.

• Pinout

  The pin count of S6J336CHTBSC20000 is 100 pins. It is a microcontroller with functions such as 32-bit ARM Cortex-R5F core, 8 MB flash memory, 640 KB RAM, CAN, LIN, and Ethernet communication interfaces, as well as various automotive-specific peripherals for applications in automotive control systems.

• Manufacturer

  Epson is the manufacturer of the S6J336CHTBSC20000. It is a Japanese multinational corporation that produces imaging and information-related equipment, including printers, projectors, scanners, and other electronic devices. Epson is known for its high-quality products and innovative technologies in various industries, such as printing, visual communications, and robotics.

• Application Field

  S6J336CHTBSC20000 is a microcontroller used in automotive applications for body control modules, gateway modules, and infotainment systems. It provides high performance, security features, and connectivity options suitable for modern vehicle systems.

• Package

  The S6J336CHTBSC20000 chip is a BGA (Ball Grid Array) package with a size of 11mm x 11mm and a form factor of 0.8mm pitch.