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NXP SC18IS602BIPW
I2C-bus to SPI bridge
Marken: NXP Semiconductor
Herstellerteil #: SC18IS602BIPW
Datenblatt: SC18IS602BIPW Datasheet (PDF)
Paket/Gehäuse: TSSOP-16
Produktart: Schnittstellen-ICs
RoHS-Status:
Lagerzustand: 2421 Stück, Neues Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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BOMSC18IS602BIPW Allgemeine Beschreibung
The SC18IS602BIPW is an I2C-bus/SPI bus interface to a dual-channel high-speed UART (Universal Asynchronous Receiver/Transmitter) IC. It is manufactured by NXP Semiconductors and is designed to provide serial communication capabilities in applications where UART communication is required.
Funktionen
Dual-Channel UART: The SC18IS602BIPW includes two UART channels, allowing it to handle communication for two separate devices simultaneously.
I2C-Bus/SPI Bus Interface: It is designed to interface with both I2C and SPI buses, providing flexibility in connecting to different microcontrollers or microprocessors.
High-Speed UART: Capable of high-speed UART communication, which is beneficial for applications requiring fast data transfer rates.
Internal Oscillator: It may include an internal oscillator for generating the required clock signals.
Programmable Baud Rate: The baud rate of the UART channels can typically be programmed to suit the requirements of the application.
16-Byte Transmit and Receive FIFOs: Includes First-In-First-Out (FIFO) buffers for both transmit and receive operations, helping to smooth the data flow.
Anwendung
Embedded Systems: Used in various embedded systems where UART communication is needed, such as interfacing with sensors, modules, or other microcontrollers.
Communication with Peripherals: Enables communication with peripheral devices using the I2C or SPI interface.
Industrial Control Systems: Applied in industrial control systems for serial communication between devices.
Data Acquisition Systems: Used in data acquisition systems where data from multiple sensors or sources need to be communicated to a central controller.
Spezifikationen
| Parameter | Wert | Parameter | Wert |
|---|---|---|---|
| Source Content uid | SC18IS602BIPW | Rohs Code | Yes |
| Part Life Cycle Code | Obsolete | Ihs Manufacturer | NXP SEMICONDUCTORS |
| Part Package Code | TSSOP | Package Description | 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 |
| Pin Count | 16 | Reach Compliance Code | |
| HTS Code | 8542.31.00.01 | Samacsys Manufacturer | NXP |
| Address Bus Width | Bus Compatibility | I2C | |
| Clock Frequency-Max | 18 MHz | External Data Bus Width | |
| JESD-30 Code | R-PDSO-G16 | JESD-609 Code | e4 |
| Length | 5 mm | Moisture Sensitivity Level | 1 |
| Number of Terminals | 16 | Operating Temperature-Max | 85 °C |
| Operating Temperature-Min | -40 °C | Package Body Material | PLASTIC/EPOXY |
| Package Code | TSSOP | Package Equivalence Code | TSSOP16,.25 |
| Package Shape | RECTANGULAR | Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 260 | Qualification Status | Not Qualified |
| Seated Height-Max | 1.1 mm | Supply Current-Max | 16 mA |
| Supply Voltage-Max | 3.6 V | Supply Voltage-Min | 2.4 V |
| Supply Voltage-Nom | 3 V | Surface Mount | YES |
| Technology | CMOS | Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | Terminal Form | GULL WING |
| Terminal Pitch | 0.65 mm | Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 | Width | 4.4 mm |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, I2C |
Versand
| Versandart | Versandgebühr | Vorlaufzeit | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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REGISTRIERTE LUFTPOST | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
Bearbeitungszeit: Die Versandkosten hängen von der jeweiligen Zone und dem Land ab.
Zahlung
| Zahlungsbedingungen | Handgebühr | |
|---|---|---|
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Banküberweisung | Bankgebühr in Höhe von 30,00 USD wird berechnet. |
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Paypal | 4,0 % Servicegebühr wird berechnet. |
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Kreditkarte | 3,5 % Servicegebühr wird berechnet. |
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Western Union | charge US.00 banking fee. |
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Geldgramm | Bankgebühr in Höhe von 0,00 USD wird berechnet. |
Garantien
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Verpackung
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Für den SC18IS602BIPW Komponente, Sie könnten diese Ersatz- und Alternativteile in Betracht ziehen:
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Teilpunkte
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The SC18IS602BIPW chip is a SPI (Serial Peripheral Interface) to I²C-bus bridge device. It allows communication between an SPI master device and multiple I²C slave devices. The chip simplifies the design of systems using microcontrollers with SPI interfaces by eliminating the need for an additional I²C interface. It is commonly used in embedded systems to enable communication between different types of devices.
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Equivalent
Some equivalent products of the SC18IS602BIPW chip include the FT200XD, MAX3107, and MCP2221A chips. -
Features
The SC18IS602BIPW is an SPI to I2C-bus bridge IC with 16 configurable I/O pins. It supports fast mode (up to 400 kHz) I2C-bus protocol and operates from a 2.4 V to 3.6 V power supply. It has a wide range of applications including LCD displays, LED displays, keypads, sensors, and other interface control purposes. -
Pinout
The SC18IS602BIPW is a 28-pin IC that acts as a bridge between SPI and I2C interfaces. It has bidirectional data transfer and supports 3.3V and 5V supply voltages. Some of its features include clock stretching, hardware addressing, and programmable I2C-bus and SPI-bus clock rates. -
Manufacturer
The manufacturer of the SC18IS602BIPW is NXP Semiconductors. NXP Semiconductors is a global semiconductor manufacturer and a leader in the industry. They design and produce a wide range of integrated circuits and other semiconductor-based solutions for various sectors, including automotive, industrial, consumer electronics, and more. -
Application Field
The SC18IS602BIPW is a versatile bridge IC that provides an SPI interface to connect various peripheral devices to an I2C-bus. It can be used in a wide range of applications, including industrial control, medical devices, consumer electronics, and communication systems, enabling seamless communication between SPI and I2C devices. -
Package
The SC18IS602BIPW chip comes in a TSSOP-28 package, implementing a four-wire bus interface with an SPI serial interface. (Note: The provided information is based on the datasheet available, but it's always essential to refer to the official manufacturer's datasheet for accurate and up-to-date information.)
Datenblatt PDF
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