Infineon TDK5110

Teilpunkte

• The TDK5110 chip is a high-performance NFC (Near Field Communication) controller chip that enables seamless communication between devices within close proximity. It is designed for use in a wide range of applications, such as mobile payment systems, access control, and IoT devices. Its compact size and low power consumption make it ideal for integration into various electronic devices.

• Equivalent

  The equivalent products of TDK5110 chip are the TDK5111, TDK5112, and TDK5113. These chips offer similar functionalities and features as the TDK5110, with slight variations in specifications and performance. Users can choose the most suitable chip based on their specific requirements.

• Features

  TDK5110 is a low noise, high performance MEMS microphone with a digital PDM output. It offers an ultra-wide frequency response range, low power consumption, and high acoustic overload point. Additionally, it is resistant to electromagnetic interference and has integrated temperature compensation for stable performance in various environments.

• Pinout

  The TDK5110 is a 32-pin dual inline package (DIP) integrated circuit with functions that include signal conditioning, filtering, amplification, and digitization for use in sensor applications such as strain gauges, pressure sensors, and accelerometers.

• Manufacturer

  The manufacturer of TDK5110 is TDK Corporation. TDK Corporation is a multinational electronics company based in Japan. They specialize in manufacturing electronic components, materials, and data storage devices for a variety of industries including automotive, consumer electronics, and industrial equipment.

• Application Field

  1. Automotive industry for advanced driver assistance systems 2. Industrial automation for precision control systems 3. Robotics for motor control and positioning applications 4. Consumer electronics for power management in portable devices 5. Renewable energy for inverters and power converters 6. Medical devices for precision control and monitoring applications

• Package

  The TDK5110 chip is available in a QFN package type, with a form factor of 3mm x 3mm. It is a Small Outline No-Lead (SON) package with a thickness of 0.75mm.