Bestellungen über
$5000TMPN3150B1AFG
IC 1 CHANNEL(S), LOCAL AREA NETWORK CONTROLLER
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Marken: Toshiba America Electronic Components
Herstellerteil #: TMPN3150B1AFG
Datenblatt: TMPN3150B1AFG Datenblatt (PDF)
Paket/Gehäuse: QFP-64
Produktart: Controllers
RoHS-Status:
Lagerzustand: 6.554 Stück, Neues Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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TMPN3150B1AFG Allgemeine Beschreibung
Engineered for automotive applications, Toshiba's TMPN3150B1AFG microprocessor is a cutting-edge embedded microcontroller. Boasting an ARM Cortex-M3 core that can run at speeds of up to 80 MHz, this microprocessor delivers exceptional performance for real-time control tasks. Its multiple peripheral interfaces, including CAN, LIN, UART, SPI, and I2C, make it a versatile choice for communication within automotive systems. The TMPN3150B1AFG also features a robust set of on-chip components like timers, PWM channels, analog-to-digital converters, and watchdog timers, streamlining system integration and control. With its automotive-grade reliability, this microprocessor is widely utilized in automotive control systems for crucial functions such as engine control, powertrain management, and chassis control
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Funktionen
- On-chip oscillator with frequency range of 32.768kHz to 50MHz
- Crystal oscillator support for more accurate timing
- Power-on reset and brown-out detection
Anwendung
- Wireless technology
- Internet connected
- Remote controls
Spezifikationen
Parameter | Wert | Parameter | Wert |
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Source Content uid | TMPN3150B1AFG | Rohs Code | Yes |
Part Life Cycle Code | Obsolete | Ihs Manufacturer | TOSHIBA CORP |
Part Package Code | QFP | Package Description | 14 X 14 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, QFP-64 |
Pin Count | 64 | Address Bus Width | 16 |
Boundary Scan | NO | Clock Frequency-Max | 10 MHz |
External Data Bus Width | 8 | JESD-30 Code | S-PQFP-G64 |
Length | 14 mm | Low Power Mode | YES |
Number of Serial I/Os | 1 | Number of Terminals | 64 |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
Package Body Material | PLASTIC/EPOXY | Package Code | QFP |
Package Shape | SQUARE | Package Style | FLATPACK |
Qualification Status | Not Qualified | Seated Height-Max | 3.15 mm |
Supply Voltage-Max | 5.5 V | Supply Voltage-Min | 4.5 V |
Supply Voltage-Nom | 5 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Form | GULL WING | Terminal Pitch | 0.8 mm |
Terminal Position | QUAD | Width | 14 mm |
uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
Versand
Versandart | Versandgebühr | Vorlaufzeit | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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REGISTRIERTE LUFTPOST | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
Bearbeitungszeit: Die Versandkosten hängen von der jeweiligen Zone und dem Land ab.
Zahlung
Zahlungsbedingungen | Handgebühr | |
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Banküberweisung | Bankgebühr in Höhe von 30,00 USD wird berechnet. |
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Paypal | 4,0 % Servicegebühr wird berechnet. |
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Kreditkarte | 3,5 % Servicegebühr wird berechnet. |
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Western Union | charge US.00 banking fee. |
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Geldgramm | Bankgebühr in Höhe von 0,00 USD wird berechnet. |
Garantien
1. Die von Ihnen gekauften elektronischen Bauteile enthalten eine 365-tägige Garantie. Wir garantieren die Produktqualität.
2. Wenn einige der Artikel, die Sie erhalten haben, nicht von perfekter Qualität sind, würden wir verantwortungsvoll Ihre Rückerstattung oder Ersatz arrangieren. Die Artikel müssen jedoch in ihrem Originalzustand verbleiben.
Verpackung
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Schritt1 :Produkt
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Schritt2 :Vakuumverpackung
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Schritt3 :Antistatikbeutel
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Schritt4 :Individuelle Verpackung
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Schritt5 :Verpackungskartons
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Schritt6 :Barcode-Versandetikett
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Auf dem äußeren ESD-Verpackungsetikett werden die Informationen unseres Unternehmens verwendet: Teilenummer, Marke und Menge.
Wir prüfen alle Waren vor dem Versand, stellen sicher, dass sich alle Produkte in gutem Zustand befinden und dass die Teile neu und original sind und mit dem Datenblatt übereinstimmen.
Nachdem alle Waren darauf überprüft wurden, dass nach dem Verpacken keine Probleme auftreten, werden wir sicher verpacken und per Global Express versenden. Es zeigt eine ausgezeichnete Durchstoß- und Reißfestigkeit sowie eine gute Dichtungsintegrität.
Teilpunkte
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TMPN3150B1AFG is a chip developed by Toshiba with integrated circuits for digital signal processing and image compression. It is designed specifically for applications in industrial image processing, security systems, and network cameras. The chip offers high-speed image processing capabilities, low power consumption, and advanced compression algorithms, making it suitable for various imaging applications.
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Equivalent
There are no direct equivalent products to the TMPN3150B1AFG chip. However, similar chips in the same family include TMPN3150B1AF, TMPN3150BXAFG, and TMPN3150BXAF. It is important to note that the specific requirements and features of the application should be taken into consideration while selecting an alternative chip. -
Features
The TMPN3150B1AFG is a System-on-Chip (SoC) designed by Toshiba. It features a high-performance ARM Cortex-A9 quad-core processor, clocked at 1.3 GHz, with integrated graphics capabilities. It is designed for use in applications such as automotive infotainment systems, industrial automation, and smart appliances. -
Pinout
The TMPN3150B1AFG is a microcontroller by Toshiba. It has 100 pins and is used for various applications, such as home appliances and industrial equipment. -
Manufacturer
The manufacturer of the TMPN3150B1AFG is Toshiba Corporation. Toshiba Corporation is a Japanese multinational conglomerate company that specializes in various products and services, including information technology, consumer electronics, and energy systems. -
Application Field
The TMPN3150B1AFG is a System-on-Chip (SoC) designed for use in digital signage applications. It offers advanced multimedia processing capabilities, including support for 4K Ultra HD video playback, audio decoding, and networking. This makes it suitable for applications such as advertising displays, information kiosks, and video walls in various public environments. -
Package
The TMPN3150B1AFG chip has a BGA package type (Ball Grid Array), it has a 272-ball form, and its size is approximately 13mm x 13mm.
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