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$5000Xilinx XC2V2000-5BG575I
2688 CLBs, 2000000 Gates
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Marken: AMD Xilinx, Inc
Herstellerteil #: XC2V2000-5BG575I
Datenblatt: XC2V2000-5BG575I Datasheet (PDF)
Paket/Gehäuse: BGA-575
Produktart: FPGAs (Field Programmable Gate Array)
RoHS-Status:
Lagerzustand: 3.782 Stück, Neues Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC2V2000-5BG575I Allgemeine Beschreibung
The XC2V2000-5BG575I FPGA, part of Xilinx's Virtex-II family, offers significant computational power and flexibility for various applications. With 2 million system gates, it provides ample resources for complex digital designs, making it suitable for demanding computing tasks. The speed grade "5" ensures reliable performance within a specific operating frequency range, crucial for real-time applications. The BGA package type "BG" provides robustness and compactness in integration, while the 575 pins enable seamless connections to external components. Moreover, the industrial temperature range "I" ensures the FPGA's reliability in harsh operating environments, making it suitable for industrial and outdoor applications where temperature extremes are a concern
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Spezifikationen
Parameter | Wert | Parameter | Wert |
---|---|---|---|
Manufacturer | XILINX | Product Category | Embedded - FPGAs (Field Programmable Gate Array) |
Series | VirtexR-II | Package-Case | 575-BBGA |
Operating-Temperature | -40°C ~ 100°C (TJ) | Mounting-Type | Surface Mount |
Voltage-Supply | 1.425 V ~ 1.575 V | Supplier-Device-Package | 575-BGA (31x31) |
Number-of-Gates | 2000000 | Number-of-I-O | 408 |
Number-of-LABs-CLBs | 2688 | Number-of-Logic-Elements-Cells | - |
Total-RAM-Bits | 1032192 | Tags | XC2V2000-5BG, XC2V2000-5B, XC2V2000-5, XC2V20, XC2V2, XC2V, XC2 |
Pbfree Code | No | Rohs Code | No |
Part Life Cycle Code | Obsolete | Ihs Manufacturer | XILINX INC |
Part Package Code | BGA | Package Description | 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575 |
Pin Count | 575 | Reach Compliance Code | not_compliant |
ECCN Code | 3A991.D | HTS Code | 8542.39.00.01 |
Clock Frequency-Max | 750 MHz | Combinatorial Delay of a CLB-Max | 0.39 ns |
JESD-30 Code | S-PBGA-B575 | JESD-609 Code | e0 |
Length | 31 mm | Moisture Sensitivity Level | 3 |
Number of CLBs | 2688 | Number of Equivalent Gates | 2000000 |
Number of Inputs | 408 | Number of Logic Cells | 24192 |
Number of Outputs | 408 | Number of Terminals | 575 |
Organization | 2688 CLBS, 2000000 GATES | Package Body Material | PLASTIC/EPOXY |
Package Code | BGA | Package Equivalence Code | BGA575,24X24,50 |
Package Shape | SQUARE | Package Style | GRID ARRAY |
Peak Reflow Temperature (Cel) | 225 | Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Qualification Status | Not Qualified | Seated Height-Max | 2.6 mm |
Supply Voltage-Max | 1.575 V | Supply Voltage-Min | 1.425 V |
Supply Voltage-Nom | 1.5 V | Surface Mount | YES |
Technology | CMOS | Terminal Finish | TIN LEAD |
Terminal Form | BALL | Terminal Pitch | 1.27 mm |
Terminal Position | BOTTOM |
Versand
Versandart | Versandgebühr | Vorlaufzeit | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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REGISTRIERTE LUFTPOST | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
Bearbeitungszeit: Die Versandkosten hängen von der jeweiligen Zone und dem Land ab.
Zahlung
Zahlungsbedingungen | Handgebühr | |
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Banküberweisung | Bankgebühr in Höhe von 30,00 USD wird berechnet. |
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Paypal | 4,0 % Servicegebühr wird berechnet. |
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Kreditkarte | 3,5 % Servicegebühr wird berechnet. |
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Western Union | charge US.00 banking fee. |
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Geldgramm | Bankgebühr in Höhe von 0,00 USD wird berechnet. |
Garantien
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2. Wenn einige der Artikel, die Sie erhalten haben, nicht von perfekter Qualität sind, würden wir verantwortungsvoll Ihre Rückerstattung oder Ersatz arrangieren. Die Artikel müssen jedoch in ihrem Originalzustand verbleiben.
Verpackung
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Auf dem äußeren ESD-Verpackungsetikett werden die Informationen unseres Unternehmens verwendet: Teilenummer, Marke und Menge.
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Nachdem alle Waren darauf überprüft wurden, dass nach dem Verpacken keine Probleme auftreten, werden wir sicher verpacken und per Global Express versenden. Es zeigt eine ausgezeichnete Durchstoß- und Reißfestigkeit sowie eine gute Dichtungsintegrität.
Teilpunkte
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XC2V2000-5BG575I is a chip model manufactured by Xilinx. It is a field-programmable gate array (FPGA) chip that offers a range of features for various applications. With a capacity of 2 million system gates, 2.1 million logic cells, and 600 available user input/output pins, it provides ample resources for designers. The chip offers reconfigurability, allowing users to modify the chip's functionality even after deployment. Its high-performance capabilities make it suitable for demanding applications in industries like aerospace, defense, and telecommunications.
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Equivalent
The equivalent products of the XC2V2000-5BG575I chip are the XC2V2000-5BF957I, XC2V2000-5BG575C, and XC2V2000-5BF957C. -
Features
The XC2V2000-5BG575I is a programmable logic device manufactured by Xilinx. It has a programmable logic capacity of 2 million system gates and 24,640 logic cells. It operates at a speed of 525 MHz and provides 36,648 flip-flop and 1,365 Kbits of RAM. It offers a variety of high-performance features and is used in various applications, including telecommunications and networking. -
Pinout
The XC2V2000-5BG575I is an FPGA (Field-Programmable Gate Array) with 575 balls (pin count). It provides programmable logic and processing capabilities for various applications, such as telecommunications, automotive, and industrial sectors. -
Manufacturer
The XC2V2000-5BG575I is manufactured by Xilinx Inc., an American technology company. It specializes in the design and production of programmable logic devices and software tools used for developing digital and mixed-signal systems. -
Application Field
The XC2V2000-5BG575I is a field-programmable gate array (FPGA) used in various application areas, including telecommunications, automotive, consumer electronics, and industrial automation. It offers high-performance processing, flexible reconfiguration, and efficient power consumption, making it suitable for a wide range of complex designs and systems. -
Package
The XC2V2000-5BG575I chip is packaged in a BGA (Ball Grid Array) package. It has a form factor of 23mm x 23mm and a size of 2,001,792 logic cells.
Datenblatt PDF
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