Xilinx XC3S250E-4FTG256I

Teilpunkte

• The XC3S250E-4FTG256I chip is a member of Xilinx's Spartan-3E FPGA family, known for its high performance and low power consumption. It has a logic capacity of 250,000 system gates and includes 249 user I/O pins. This chip is suitable for a wide range of applications, including industrial control, automotive, and communication systems.

• Equivalent

  Some equivalent products of XC3S250E-4FTG256I chip are Xilinx XC3S500E-4FG320I, Xilinx XC3S200-4PQG208I, and Xilinx XC3S1000-4FTG256C.

• Features

  XC3S250E-4FTG256I is a FPGA with 250K logic cells, 112 I/O pins, 24 DSP slices, and 7680 logic slices. It operates at a speed of 70-100 MHz and has a built-in JTAG programming interface. It also features on-chip configurable memory blocks, integrated power management, and high-speed transceivers.

• Pinout

  XC3S250E-4FTG256I is a Spartan-3E FPGA from Xilinx with a pin count of 256. It features 250,000 system gates, up to 288 user I/Os, 68 Block RAM/FIFO, and 4 Digital Clock Managers.

• Manufacturer

  XC3S250E-4FTG256I is manufactured by Xilinx, Inc. Xilinx is a semiconductor company that produces programmable logic devices, including field-programmable gate arrays (FPGAs). They are known for their high-performance and innovative solutions for a wide range of applications, such as data centers, automotive, aerospace, and telecommunications.

• Application Field

  The XC3S250E-4FTG256I is a Field-Programmable Gate Array (FPGA) that is commonly used in applications such as telecommunications equipment, industrial automation, medical devices, and military/aerospace systems. It is also suitable for high-performance computing, encryption, signal processing, and image/video processing.

• Package

  The XC3S250E-4FTG256I chip is in a Ball Grid Array (BGA) package with 256 pins. It is in a Field Programmable Gate Array (FPGA) form factor with a size of 17mm x 17mm.