Xilinx XC3SD3400A-4FGG676I

Teilpunkte

• The XC3SD3400A-4FGG676I is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It features a high-density design with 340,000 logic cells and operates at a speed grade of -4. The chip is housed in a 676-pin fine-pitch ball grid array (FBGA) package, making it suitable for a wide range of applications including telecommunications, automotive, and industrial control systems.

• Equivalent

  Possible equivalent products of XC3SD3400A-4FGG676I chip are Xilinx XC3S400, Spartan-3A, and XC3S400A. These chips have similar functionalities and features, making them suitable replacements for XC3SD3400A-4FGG676I in various applications.

• Features

  XC3SD3400A-4FGG676I is a Spartan-3A FPGA from Xilinx with 3400 logic cells, 240 Kbits of block RAM, and 168 user I/Os. It features a high performance, low power architecture, and built-in clock management capabilities. It also includes embedded multipliers for efficient signal processing applications.

• Pinout

  The XC3SD3400A-4FGG676I is a field-programmable gate array (FPGA) with 676 pins. It features large logic capacity, multiple I/O standards, and integrated DSP capabilities for high-performance applications.

• Manufacturer

  The manufacturer of XC3SD3400A-4FGG676I is Xilinx. Xilinx is a leading American technology company specializing in the development of programmable devices, such as field-programmable gate arrays (FPGAs) and software development tools. Xilinx's products are used in a wide range of industries, including aerospace, automotive, telecommunications, and data centers.

• Application Field

  The XC3SD3400A-4FGG676I is commonly used in high-performance applications such as telecommunications, networking, industrial automation, and medical equipment. It is also suitable for use in aerospace and defense systems, automotive electronics, and consumer electronics.

• Package

  The XC3SD3400A-4FGG676I chip is a FPGA chip. It comes in a 676-ball FineLine BGA package, with a size of 27x27mm.