Xilinx XC5VLX50T-1FFG1136I

Teilpunkte

• The XC5VLX50T-1FFG1136I is a Field Programmable Gate Array (FPGA) chip from Xilinx with 50,000 logic cells, advanced features, and high-performance capabilities. It is ideal for applications requiring complex digital processing, signal processing, and system integration. The chip is designed to be easily reprogrammed for various tasks, making it a versatile solution for a wide range of applications.

• Equivalent

  The equivalent products of XC5VLX50T-1FFG1136I chip are XC5VLX50T-1FFG676C, XC5VLX50T-1FFG676I, XC5VLX50T-1FFG676CES, XC5VLX50T-1FFG676I, XC5VLX50T-1FFG1136C, XC5VLX50T-1FFG1136I, XC5VLX50T-1FFG1136CES, and XC5VLX50T-1FFG1136I from Xilinx.

• Features

  The XC5VLX50T-1FFG1136I is a Xilinx Virtex-5 FPGA with 50,000 logic cells, 1,154 I/O pins, and 36 RocketIO transceivers. It has a maximum gate frequency of 550 MHz, 576 Kb of block RAM, and 1.16 Mb of distributed RAM. It also features embedded multipliers, digital clock managers, and advanced connectivity interfaces.

• Pinout

  The XC5VLX50T-1FFG1136I is a Virtex-5 FPGA with 1136 pins. It has 50,000 logic cells for general-purpose logic functions, 55,000 slices with four 6-input LUTs, and 2,160Kb of block RAM. The device also has 500 I/O pins supporting LVCMOS, LVTTL, HSTL, SSTL, GTL, LVDS, LVPECL, and HT interfaces.

• Manufacturer

  The XC5VLX50T-1FFG1136I is manufactured by Xilinx, Inc., which is a leading American technology company specializing in FPGA (Field-Programmable Gate Array) and programmable logic devices. Xilinx is known for its high-quality semiconductor products used in a wide range of industries such as telecommunications, automotive, aerospace, and defense.

• Application Field

  The XC5VLX50T-1FFG1136I FPGA is commonly used in networking equipment, communication systems, high-speed data processing, image and signal processing, and advanced digital signal processing applications. It is also suitable for use in aerospace and defense, automotive, and industrial automation systems due to its high performance and flexibility.

• Package

  The XC5VLX50T-1FFG1136I chip is in a flip-chip ball grid array (FCBGA) package. It is in a 1136-pin package form. The size of the package is 35mm x 35mm.