Xilinx XC6SLX100T-3FGG900C

Teilpunkte

• The XC6SLX100T-3FGG900C chip is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. It belongs to the Spartan-6 family and has 101,261 logic cells. It operates at a maximum frequency of 450 MHz and is built using a 45nm process technology. This chip offers high performance and flexibility, making it suitable for a wide range of applications in industries such as communications, automotive, and industrial control.

• Equivalent

  XC6VLX240T-3FFG1156C, XC6SLX100T-3CSG484C, and XC6VLX240T-3FFG1156I are some equivalent products to the XC6SLX100T-3FGG900C chip.

• Features

  The XC6SLX100T-3FGG900C is a field-programmable gate array (FPGA) with a capacity of 100,000 logic cells. It operates at a speed grade of -3, meaning it can run at a maximum of 500 MHz. It features a 900-ball flip-chip package and is part of the Spartan-6 family of FPGAs from Xilinx.

• Pinout

  The XC6SLX100T-3FGG900C is a field-programmable gate array (FPGA) with 900 pins. It belongs to the Spartan-6 family and has a -3 speed grade. The specific functions and pin assignments would depend on the configuration and design implemented by the user.

• Manufacturer

  Xilinx, Inc. is the manufacturer of the XC6SLX100T-3FGG900C. It is an American technology company specializing in the development and production of programmable logic devices and related software tools.

• Application Field

  The XC6SLX100T-3FGG900C is a field-programmable gate array (FPGA) that is used in a wide range of applications including aerospace, telecommunications, industrial automation, and automotive industries. It is suitable for applications that require high-performance processing, low-power consumption, and programmable logic capabilities.

• Package

  The XC6SLX100T-3FGG900C chip has a package type of Flip Chip, a form factor of BGA and a size measurement of 19mm x 19mm.