Xilinx XC6SLX25-2CSG324C

Teilpunkte

• The XC6SLX25-2CSG324C chip is a member of the Spartan-6 FPGA family manufactured by Xilinx. It offers a balance between performance, power consumption, and cost. The chip has 24,576 logic cells and supports various applications, including embedded processing, high-bandwidth communication systems, and industrial automation. It features low power consumption and is programmable to meet specific design requirements.

• Equivalent

  Some equivalent products of the XC6SLX25-2CSG324C chip are the XC6SLX25-2FGG324C, XC6SLX25-2FTG256C, and XC6SLX25-2FTG256I chips.

• Features

  The XC6SLX25-2CSG324C is a field-programmable gate array (FPGA) with 24,576 logic cells, offering 900 MHz maximum operating frequency. It has 240 input/output pins and supports a variety of interfaces, including DDR, PCIe, and Ethernet. It also includes built-in features like block RAM, DSP slices, and multiple clock management resources.

• Pinout

  The XC6SLX25-2CSG324C is an FPGA with a pin count of 324. It is part of the Spartan-6 family and has a logic cell capacity of 24,576 and 25,920 flip-flops. Its functions include programmable digital logic and signal processing, along with various configurable I/O options.

• Manufacturer

  The manufacturer of the XC6SLX25-2CSG324C is Xilinx. Xilinx is an American technology company that specializes in the development and production of programmable logic devices and associated software tools. They are known for their FPGA (Field-Programmable Gate Array) products, which are widely used in various industries for applications such as artificial intelligence, 5G wireless communications, and automotive electronics.

• Application Field

  The XC6SLX25-2CSG324C is a field-programmable gate array (FPGA) that can be used in various application areas, including communications, automotive, consumer electronics, industrial control, and aerospace. It is suitable for implementing complex digital designs and offers high-performance, low-power capabilities.

• Package

  The XC6SLX25-2CSG324C chip has a 324-ball grid array (BGA) package type. It is in the column-staggered (CS) form, and its size is 15mm x 15mm in dimensions.