Xilinx XC6SLX75-3CSG484C

Teilpunkte

• The XC6SLX75-3CSG484C is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It belongs to the Spartan-6 family and has 75,000 logic cells along with various I/O ports. The chip operates at a speed grade of -3 and uses a 484-ball package. It offers advanced features for digital logic design and can be programmed to perform a wide range of tasks in various applications.

• Equivalent

  The equivalent products of the XC6SLX75-3CSG484C chip are the XC6SLX75-2FGG484C, XC6SLX75-3FGG484C, and XC6SLX75-2CSG484C chips.

• Features

  The XC6SLX75-3CSG484C is an FPGA from Xilinx. Its key features include a maximum of 74,880 logic cells, 5,120 slices, a clock speed of 550MHz, support for various I/O standards, built-in digital clock management, and extensive programmability for implementing various applications in areas like telecommunications, automotive, and industrial markets.

• Pinout

  The XC6SLX75-3CSG484C is an FPGA (Field-Programmable Gate Array) device from Xilinx. It has 484 pins and belongs to the Spartan-6 LX family. This specific variant does not provide direct information about its pin function. The pin functions can vary based on the user's design and configuration of the FPGA.

• Manufacturer

  The manufacturer of the XC6SLX75-3CSG484C is Xilinx Inc. Xilinx is an American technology company specializing in the development and manufacturing of programmable logic devices (PLDs) and associated software tools. They are known for their field-programmable gate arrays (FPGAs), which are widely used in various industries for applications such as data processing, image/video processing, networking, and more.

• Application Field

  The XC6SLX75-3CSG484C is commonly used in applications such as low-power wireless communications, automotive driver assistance, high-performance computing, medical imaging, and aerospace and defense.

• Package

  The XC6SLX75-3CSG484C chip is a Field-Programmable Gate Array (FPGA) with a CSP (Chip Scale Package) form factor. It measures 17mm x 17mm and has a 484-ball grid array (BGA) package.