Xilinx XC6SLX75T-2FGG484C

Teilpunkte

• The XC6SLX75T-2FGG484C is a field-programmable gate array (FPGA) chip produced by Xilinx. It has a capacity of 75,000 logic cells and belongs to the Spartan-6 LX family. This chip offers a range of programmable features and is commonly used in applications like telecommunications, automotive, and industrial control systems. The code "2FGG484C" represents specific packaging and electrical characteristics of the chip.

• Equivalent

  There aren't any exact equivalent products for XC6SLX75T-2FGG484C chip. However, similar products from Xilinx include XC6SLX75-2FGG484C and XC6SLX100T-2FGG484C, which offer comparable features and functionality.

• Features

  The XC6SLX75T-2FGG484C is a field-programmable gate array (FPGA) featuring 75,000 logic cells, 384 DSP48E1 slices, and 840 KB of block RAM. It operates at a maximum speed of 667 MHz and supports various I/O standards, including LVCMOS, LVDS, and single-ended clock inputs. The device is optimized for high-performance applications, including in the fields of telecommunications, automotive, and industrial automation.

• Pinout

  The XC6SLX75T-2FGG484C has 484 pins and is a field-programmable gate array (FPGA) from Xilinx. It is part of the Spartan-6 LX family and is capable of providing programmable logic and digital signal processing (DSP) capabilities for various applications.

• Manufacturer

  The manufacturer of the XC6SLX75T-2FGG484C is Xilinx. Xilinx is a multinational technology company specializing in the development and production of programmable logic devices and associated technologies. Their products are widely used in various industries, including telecommunications, automotive, industrial, and defense sectors, offering flexible and customizable solutions for electronic systems.

• Application Field

  The XC6SLX75T-2FGG484C is a field-programmable gate array (FPGA) that can be used in various applications such as aerospace and defense, automotive, consumer electronics, and telecommunications. It offers high-performance processing and flexible programmability, making it suitable for a wide range of applications requiring customizable and scalable digital logic.

• Package

  The XC6SLX75T-2FGG484C chip is offered in a Flip-Chip, Fine-Pitch Ball Grid Array (FBGA) package type. It has 484 pins and is classified as a 23x23mm chip.