Xilinx XC6VLX365T-2FFG1156I

Teilpunkte

• The XC6VLX365T-2FFG1156I is a field-programmable gate array (FPGA) chip from Xilinx. It features 365,760 logic cells, 12.34 Mb of RAM, and 600 MHz maximum operating frequency. This chip is ideal for high-performance applications such as telecommunications, networking, and high-speed computing.

• Equivalent

  Some equivalent products to the XC6VLX365T-2FFG1156I chip are the Xilinx XC6VLX365T-1FFG1156I and the Xilinx XC6VLX365T-3FFG1156I. These chips have the same specifications but different operating temperature ranges.

• Features

  XC6VLX365T-2FFG1156I is a Virtex-6 FPGA from Xilinx with 365k Logic Cells, 23,760 slices, 72 DSP slices, and 870 I/Os. It operates at a maximum speed of 550 MHz and has a total memory of 3.7 Mb. The device is built on a 40nm process and features advanced DSP capabilities, making it suitable for high-performance applications.

• Pinout

  XC6VLX365T-2FFG1156I is a Virtex-6 FPGA with 1156 pins. It features 365,760 logic cells, 7.33 Mb of memory, and 728 DSP slices. It also includes PCI Express Gen2, tri-mode Ethernet MACs, and 12.5 Gbps transceivers.

• Manufacturer

  The XC6VLX365T-2FFG1156I is manufactured by Xilinx, an American technology company specializing in the development of field-programmable gate array (FPGA) and programmable logic devices. Xilinx is a semiconductor company that designs and sells programmable devices to companies in various industries such as aerospace, automotive, consumer electronics, and telecommunications.

• Application Field

  XC6VLX365T-2FFG1156I is commonly used in high-performance applications such as telecommunications, networking, military and aerospace, automotive, and medical imaging. Its high processing power, low power consumption, and advanced features make it suitable for demanding applications that require fast and reliable data processing.

• Package

  The XC6VLX365T-2FFG1156I chip is a Field-Programmable Gate Array (FPGA) with a Ball Grid Array (BGA) package type. It comes in a 1156-pin package with a form factor of Flip Chip and a size of 31mm x 31mm.