Xilinx XC6VSX315T-1FFG1759I

Teilpunkte

• The XC6VSX315T-1FFG1759I is a field-programmable gate array (FPGA) chip from Xilinx, featuring high-performance capabilities for advanced digital signal processing and communication applications. It offers a large number of programmable logic cells, abundant memory resources, and fast processing speeds. With its versatile functionality and customizable design, the XC6VSX315T-1FFG1759I is widely used in telecommunications, networking, aerospace, and other industries.

• Equivalent

  Some equivalent products of XC6VSX315T-1FFG1759I chip are XC6VSX315T-2FFG1759I, XC6VSX315T-3FFG1759I, and XC6VSX315T-4FFG1759I, which also belong to the Xilinx Virtex-6 FPGA family, with the same density and package type.

• Features

  The XC6VSX315T-1FFG1759I is a high-performance field programmable gate array (FPGA) with 315K logic cells, 915 I/O ports, and 36.7 Mb of block RAM. It supports up to 1596 user I/O pins, 24 6.25 Gb/s transceivers, and features Xilinx's advanced 45 nm process technology for low power consumption and high-speed performance.

• Pinout

  The XC6VSX315T-1FFG1759I has 1759 pins. It is a Virtex-6 FPGA that offers high performance and integrated features for industrial applications, with a focus on delivering high-speed processing capabilities and low power consumption.

• Manufacturer

  The manufacturer of XC6VSX315T-1FFG1759I is Xilinx. Xilinx is an American technology company that specializes in the development and production of field-programmable gate arrays (FPGAs) and other semiconductor devices used in a wide range of industries including aerospace, automotive, and telecommunications.

• Application Field

  The XC6VSX315T-1FFG1759I FPGA can be used in various high-performance applications such as telecommunications infrastructure, industrial automation, medical imaging, military/aerospace, and automotive industries. Its high logic and DSP processing capabilities make it suitable for demanding applications requiring fast data processing, low latency, and high reliability.

• Package

  The XC6VSX315T-1FFG1759I chip is packaged in a Flip Chip Ball Grid Array (FCBGA) with a 1759-pin configuration. It has a form factor of 35mm x 35mm and a size of 1759 square mm.