Xilinx XC7K410T-1FBG676I

Teilpunkte

• The XC7K410T-1FBG676I is a Xilinx Kintex-7 FPGA (Field Programmable Gate Array) chip that offers high performance and flexibility for a wide range of applications. It features 410,000 logic cells, multiple input/output options, and advanced programmability. This chip is commonly used in telecommunications, automotive, aerospace, and other industries where high-speed processing and data analysis are required.

• Equivalent

  Some equivalent products to the XC7K410T-1FBG676I chip include the XC7K325T-1FFG676C and XC7K355T-2FFG676I chips from Xilinx. These chips offer similar features and performance characteristics suitable for a range of applications requiring high-performance processing capabilities.

• Features

  XC7K410T-1FBG676I is a Xilinx Kintex-7 FPGA with 410,000 logic cells, 2,560 DSP slices, and 1,440kbits of internal memory. It features up to 76 user I/Os, PCIe Gen2 x8 connectivity, and integrated rocketIO GTP transceivers. The device operates at a maximum speed of 400MHz and has a total of 676 pins in a FBGA package.

• Pinout

  The XC7K410T-1FBG676I is a BGA package with 676 pins. It is a Xilinx Kintex-7 FPGA with 410K logic cells, 1040 DSP slices, and 720 I/O pins. It features a high-performance and low-power design suitable for applications requiring intensive processing and high-speed connectivity.

• Manufacturer

  XC7K410T-1FBG676I is manufactured by Xilinx, Inc., a leading American technology company known for its semiconductor products, primarily programmable logic devices like FPGAs and CPLDs. Xilinx also offers software tools, IP cores, and development boards for designing applications in sectors ranging from telecommunications and aerospace to automotive and industrial automation.

• Application Field

  The XC7K410T-1FBG676I is mainly used in high-performance applications such as telecommunications, aerospace, defense, industrial automation, and scientific research. Its versatile capabilities make it suitable for applications that require high-speed data processing, complex algorithm implementation, and advanced signal processing.

• Package

  The XC7K410T-1FBG676I chip is a Field Programmable Gate Array (FPGA) in a Ball Grid Array (BGA) package. It has a 676-pin BGA form factor with a size of 27x27 mm.