Xilinx XCKU085-1FLVA1517I

Teilpunkte

• The XCKU085-1FLVA1517I is a high-performance field-programmable gate array (FPGA) chip from Xilinx's Kintex UltraScale+ series. It features a large amount of programmable logic, high-speed interfaces, and advanced DSP capabilities. This chip is commonly used in applications requiring high computational power and flexibility, such as data centers, networking equipment, and industrial automation.

• Equivalent

  The equivalent products of XCKU085-1FLVA1517I chip are XCKU085-2FFVA1517E, XCKU085-3FFVA1517E, and XCKU085-1FLVA1517E. These chips are part of the Xilinx Kintex UltraScale family and offer similar performance and features to the XCKU085-1FLVA1517I.

• Features

  - Xilinx Kintex UltraScale FPGA - 37, 000 logic cells, 2,520 DSP slices - 8.6 Mb of block RAM, 24 Mb of UltraRAM - 32 GTH transceivers, 16 GTP transceivers - 256 user I/Os, 32 LVDS pairs - Maximum operating frequency of 1.5 GHz - Industrial temperature grade (-40°C to 100°C)

• Pinout

  The XCKU085-1FLVA1517I is a 1156-pin Field Programmable Gate Array (FPGA) from Xilinx. It features 85,740 logic cells, 2136 DSP slices, and 27.2 Mb of memory. The device is ideal for high-performance computing and communication applications.

• Manufacturer

  The XCKU085-1FLVA1517I is manufactured by Xilinx, an American technology company specializing in the development of programmable logic devices such as field-programmable gate arrays (FPGAs). Xilinx is known for its innovation in the semiconductor industry and providing solutions for a wide range of applications including data centers, automotive, aerospace, and telecommunications.

• Application Field

  The XCKU085-1FLVA1517I is commonly used in high-performance applications such as telecommunications, aerospace, defense, industrial automation, and automotive industries. It is suitable for image and signal processing, data communication, machine learning, and other demanding tasks that require high-speed processing and low power consumption.

• Package

  The XCKU085-1FLVA1517I chip comes in a flip-chip BGA (Ball Grid Array) package with a size of 35mm x 35mm.