Intel 10AX115S2F45I1SG

Teilpunkte

• The 10AX115S2F45I1SG chip is a high-performance field-programmable gate array (FPGA) developed by Intel. It features 115,000 logic elements, 230 DSP blocks, and 4.5 Mb of embedded memory. This chip is designed for applications requiring high-speed processing, flexibility, and scalability.

• Equivalent

  Some equivalent products of the 10AX115S2F45I1SG chip are Xilinx Artix-7 family FPGAs, such as the XC7A100T-2FGG484I and XC7A100T-2FGG676I. Other alternatives include the Altera Cyclone V and Intel MAX 10 FPGAs.

• Features

  The 10AX115S2F45I1SG features a compact size, 10A current rating, 115V voltage rating, SPST-1NO contact configuration, and a snap-action mechanism. It is designed for high reliability and long lifespan in various industrial applications.

• Pinout

  The 10AX115S2F45I1SG is a FPGA (Field Programmable Gate Array) with a pin count of 115. It offers a versatile platform for digital design, with features such as programmable logic cells, embedded memory blocks, and DSP blocks. This FPGA is suitable for a wide range of applications in industries like telecommunications, automotive, and aerospace.

• Manufacturer

  10AX115S2F45I1SG is manufactured by intel. Intel is an American multinational corporation that creates technology products, including microprocessors, integrated graphics, and platform solutions for communications and computing. They are also known for developing the x86 series of microprocessors, which are widely used in personal computers.

• Application Field

  1. Automotive industry for sensors and control systems 2. Industrial automation for motion control and robotics 3. Medical equipment for diagnostic and monitoring devices 4. Aerospace industry for avionics and guidance systems 5. Consumer electronics for smartphones and tablets 6. Energy sector for power management and grid control 7. Telecommunications for network infrastructure 8. Security systems for access control and surveillance 9. Home automation for smart home devices and IoT applications 10. Military and defense for radar and communication systems.

• Package

  The 10AX115S2F45I1SG chip is a field-programmable gate array (FPGA) with a ball grid array (BGA) package type. It comes in a 1156-ball package with a size of 17mm x 17mm.