Altera 5CGXFC7D6F31C6N

Teilpunkte

• The 5CGXFC7D6F31C6N chip is a high-performance FPGA chip from Intel that is ideal for a wide range of applications, including networking, telecommunications, and industrial automation. It features a large number of configurable logic elements, high-speed transceivers, and advanced signal processing capabilities, making it a versatile solution for complex designs.

• Equivalent

  Some possible equivalent products of the 5CGXFC7D6F31C6N chip are the 5CGXFC7D6F31I7N, 5CGXFC7D6F31C6, and 5CGXFC7G6F31C6N chips. These chips are all part of the Intel Cyclone V series of field-programmable gate arrays (FPGAs) and offer similar features and performance capabilities.

• Features

  The 5CGXFC7D6F31C6N is a low-cost, low-power FPGA with 622K LEs, 29.9 Mb RAM, and 26.6 Gbps transceiver bandwidth. It features advanced security features, flexible clocking options, PCIe Gen2 x4 capability, and support for various I/O standards. This FPGA is ideal for applications in communications, industrial, automotive, and defense sectors.

• Pinout

  The pin count of the 5CGXFC7D6F31C6N is 672. It is a Cyclone V FPGA with 65k logic elements, 4291 Kbits embedded memory, and 216 18x18 multipliers. It is designed for high-performance applications such as communications infrastructure, industrial automation, and automotive.

• Manufacturer

  5CGXFC7D6F31C6N is a product of Intel Corporation, a multinational technology company that specializes in manufacturing semiconductor chips and other computer-related products. Intel is one of the world's largest and highest valued semiconductor chip makers based on its revenue and is the inventor of the x86 series of microprocessors which power most personal computers.

• Application Field

  Industrial automation, automotive systems, telecommunications, high-speed networking, and medical imaging are some of the application areas of the 5CGXFC7D6F31C6N field-programmable gate array (FPGA). Its high processing power, flexibility, and reliability make it suitable for a wide range of embedded systems and high-performance computing applications.

• Package

  The 5CGXFC7D6F31C6N chip comes in a Ball Grid Array (BGA) package type with a form factor of 1152-BGA. It has a size of 31mm x 31mm.