Bestellungen über
$5000Renesas CDP1802ACD3
CMOS 8-Bit Microprocessors
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Marken: Renesas Technology Corp
Herstellerteil #: CDP1802ACD3
Datenblatt: CDP1802ACD3 Datasheet (PDF)
Paket/Gehäuse: CDIP40
Produktart: Microprocessors
RoHS-Status:
Lagerzustand: 3.587 Stück, Neues Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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CDP1802ACD3 Allgemeine Beschreibung
The CDP1802A/3 High-Reliability LSI CMOS 8-bit register oriented Central-Processing Unit (CPU) is designed for use as a general purpose computing or control element in a wide range of stored-program systems or products. The CDP1802A/3 includes all of the circuits required for fetching, interpreting, and executing instructions which have been stored in standard types of memories. Extensive input/output (I/O) control features are also provided to facilitate system design. The 1800 Series Architecture is designed with emphasis on the total microcomputer system as an integral entity so that systems having maximum flexibility and minimum cost can be realized. The 1800 Series CPU also provides a synchronous interface to memories and external controllers for I/O devices, and minimizes the cost of interface controllers. Further, the I/O interface is capable of supporting devices operating in polled, interrupt-driven, or direct memory-access modes. The CDP1802AC/3 is functionally identical to its predecessor, the CDP1802. The A version includes some performance enhancements and can be used as a direct replacement in systems using the CDP1802. This type is supplied in a 40 Ld dual-in-line sidebrazed ceramic package (D suffix).
![cdp1802acd3 cdp1802acd3](/files/uploads/product/b/cdp1802acd320170509133637_3864.jpg)
Funktionen
- For Use In Aerospace, Military, and Critical Industrial Equipment
- Minimum Instruction Fetch-Execute Time of 4.5µs (Maximum Clock Frequency of 3.6MHz) at VDD = 5V, TA = +25°C
- Operation Over the Full Military Temperature Range -55°C to +125°C
- Any Combination of Standard RAM and ROM Up to 65,536 Bytes
- 8-Bit Parallel Organization With Bi-directional Data Bus and Multiplexed Address Bus
- 16x16 Matrix of Registers for Use as Multiple Program Counters, Data Pointers, or Data Registers
- On-Chip DMA, Interrupt, and Flag Inputs
- High Noise Immunity 30% of VDD
- Pb-Free (RoHS compliant)
![cdp1802acd3 cdp1802acd3](/files/uploads/product/b/cdp1802acd320171201185133_3239.jpg)
![cdp1802acd3 cdp1802acd3](/files/uploads/product/b/cdp1802acd320171209151823_0202.jpg)
Spezifikationen
Parameter | Wert | Parameter | Wert |
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Pin Count | 40 | Package Category | Ceramic Dual-In-Line Packages |
Released Date | Feb 24, 2023 |
Versand
Versandart | Versandgebühr | Vorlaufzeit | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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REGISTRIERTE LUFTPOST | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
Bearbeitungszeit: Die Versandkosten hängen von der jeweiligen Zone und dem Land ab.
Zahlung
Zahlungsbedingungen | Handgebühr | |
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Banküberweisung | Bankgebühr in Höhe von 30,00 USD wird berechnet. |
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Paypal | 4,0 % Servicegebühr wird berechnet. |
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Kreditkarte | 3,5 % Servicegebühr wird berechnet. |
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Western Union | charge US.00 banking fee. |
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Geldgramm | Bankgebühr in Höhe von 0,00 USD wird berechnet. |
Garantien
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2. Wenn einige der Artikel, die Sie erhalten haben, nicht von perfekter Qualität sind, würden wir verantwortungsvoll Ihre Rückerstattung oder Ersatz arrangieren. Die Artikel müssen jedoch in ihrem Originalzustand verbleiben.
Verpackung
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Schritt1 :Produkt
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Schritt2 :Vakuumverpackung
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Schritt3 :Antistatikbeutel
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Schritt4 :Individuelle Verpackung
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Schritt5 :Verpackungskartons
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Schritt6 :Barcode-Versandetikett
Alle Produkte werden in antistatischen Beuteln verpackt. Versand mit ESD-Antistatikschutz.
Auf dem äußeren ESD-Verpackungsetikett werden die Informationen unseres Unternehmens verwendet: Teilenummer, Marke und Menge.
Wir prüfen alle Waren vor dem Versand, stellen sicher, dass sich alle Produkte in gutem Zustand befinden und dass die Teile neu und original sind und mit dem Datenblatt übereinstimmen.
Nachdem alle Waren darauf überprüft wurden, dass nach dem Verpacken keine Probleme auftreten, werden wir sicher verpacken und per Global Express versenden. Es zeigt eine ausgezeichnete Durchstoß- und Reißfestigkeit sowie eine gute Dichtungsintegrität.
Teilpunkte
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The CDP1802ACD3 chip is a variant of the RCA CDP1802 microprocessor. It is an 8-bit microprocessor designed for low-power and low-cost applications. It has a simple architecture, including 16 opcodes and a 16-bit address bus. The chip was widely used in early microcomputers and embedded systems, providing basic computing capabilities.
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Equivalent
The equivalent products of CDP1802ACD3 chip are: CDP1802ACE, CDP1802ACF, CDP1802AD, CDP1802AF, CDP1802CF, CDP1802CE, CDP1802CD, CDP1802BF, CDP1802BE, CDP1802BC, CDP1802BD, CDP1802AC, and CDP1802BCD3. -
Features
The CDP1802ACD3 is a 8-bit microprocessor with an integrated on-chip clock generator and 16 I/O pins. It operates at a clock speed of 2MHz and has a 16-bit address bus and an 8-bit data bus. It is designed for low power consumption and is capable of operating in a wide range of temperatures. -
Pinout
The CDP1802ACD3 has 40 pins. It is an 8-bit microprocessor with a single accumulator and 16-bit address space. Its functions include executing instructions, performing arithmetic and logic operations, and interfacing with external devices through its I/O pins. -
Manufacturer
Rockwell International Corporation is the manufacturer of the CDP1802ACD3. It was a diversified multinational company that produced electronics, aerospace, automotive, and telecommunications equipment. -
Application Field
The CDP1802ACD3 microprocessor is often used in embedded systems and applications that require low power consumption and reliability. It can be found in various devices such as industrial controllers, spacecraft, medical monitoring equipment, and vintage computer systems. -
Package
The CDP1802ACD3 chip is available in a 40-pin dual in-line package (DIP). It has a ceramic substrate and a small form factor, which makes it compact in size.
Datenblatt PDF
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