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$5000DMP6110SSS-13
Unipolar transistor suitable for various electronic applications
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Marken: Diodes Incorporated
Herstellerteil #: DMP6110SSS-13
Datenblatt: DMP6110SSS-13 Datenblatt (PDF)
Paket/Gehäuse: 8-SOIC
Produktart: Single FETs, MOSFETs
RoHS-Status:
Lagerzustand: 5.134 Stück, Neues Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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DMP6110SSS-13 Allgemeine Beschreibung
Discover the DMP6110SSS-13, an advanced microcontroller unit (MCU) developed by Dialog Semiconductor, designed specifically for Bluetooth Low Energy (BLE) applications in Internet of Things (IoT) devices. The MCU features a powerful Arm Cortex-M33 processor with floating-point unit (FPU) running at up to 96 MHz, providing high performance and efficiency for a wide range of IoT applications. Its ultra-low power consumption and advanced security features, such as secure boot and secure firmware updates, ensure the integrity and confidentiality of data in connected devices. Additionally, the DMP6110SSS-13 includes a rich set of peripherals, including ADC, PWM, UART, SPI, I2C, and GPIO, enabling versatile connectivity and interface options for various sensors and actuators in IoT applications. Moreover, it supports multiple power modes for optimizing energy consumption in different usage scenarios, making it suitable for battery-powered devices
![DMP6110SSS-13 DMP6110SSS-13](/files/uploads/product/b/b428f8c9a76540da95fc573bfb0a48d6.webp)
Funktionen
- Low On-Resistance
- Low Gate Threshold Voltage
- Low Input Capacitance
- Fast Switching Speed
- Low Input/ Output Leakage
- Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
- Halogen and Antimony Free. “Green” Device (Note 3 )
- Qualified to AEC-Q101 standards for High Reliability
Spezifikationen
Parameter | Wert | Parameter | Wert |
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Product Status | Active | FET Type | P-Channel |
Technology | MOSFET (Metal Oxide) | Drain to Source Voltage (Vdss) | 60 V |
Current - Continuous Drain (Id) @ 25°C | 4.5A (Ta) | Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V |
Rds On (Max) @ Id, Vgs | 110mOhm @ 4.5A, 10V | Vgs(th) (Max) @ Id | 3V @ 250µA |
Gate Charge (Qg) (Max) @ Vgs | 19.4 nC @ 10 V | Vgs (Max) | ±20V |
Input Capacitance (Ciss) (Max) @ Vds | 1030 pF @ 30 V | Power Dissipation (Max) | 1.5W (Ta) |
Operating Temperature | -55°C ~ 150°C (TJ) | Mounting Type | Surface Mount |
Supplier Device Package | 8-SO | Package / Case | 8-SOIC (0.154", 3.90mm Width) |
Base Product Number | DMP6110 |
Versand
Versandart | Versandgebühr | Vorlaufzeit | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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REGISTRIERTE LUFTPOST | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
Bearbeitungszeit: Die Versandkosten hängen von der jeweiligen Zone und dem Land ab.
Zahlung
Zahlungsbedingungen | Handgebühr | |
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Banküberweisung | Bankgebühr in Höhe von 30,00 USD wird berechnet. |
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Paypal | 4,0 % Servicegebühr wird berechnet. |
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Kreditkarte | 3,5 % Servicegebühr wird berechnet. |
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Western Union | charge US.00 banking fee. |
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Geldgramm | Bankgebühr in Höhe von 0,00 USD wird berechnet. |
Garantien
1. Die von Ihnen gekauften elektronischen Bauteile enthalten eine 365-tägige Garantie. Wir garantieren die Produktqualität.
2. Wenn einige der Artikel, die Sie erhalten haben, nicht von perfekter Qualität sind, würden wir verantwortungsvoll Ihre Rückerstattung oder Ersatz arrangieren. Die Artikel müssen jedoch in ihrem Originalzustand verbleiben.
Verpackung
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Schritt1 :Produkt
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Schritt2 :Vakuumverpackung
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Schritt3 :Antistatikbeutel
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Schritt4 :Individuelle Verpackung
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Schritt5 :Verpackungskartons
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Schritt6 :Barcode-Versandetikett
Alle Produkte werden in antistatischen Beuteln verpackt. Versand mit ESD-Antistatikschutz.
Auf dem äußeren ESD-Verpackungsetikett werden die Informationen unseres Unternehmens verwendet: Teilenummer, Marke und Menge.
Wir prüfen alle Waren vor dem Versand, stellen sicher, dass sich alle Produkte in gutem Zustand befinden und dass die Teile neu und original sind und mit dem Datenblatt übereinstimmen.
Nachdem alle Waren darauf überprüft wurden, dass nach dem Verpacken keine Probleme auftreten, werden wir sicher verpacken und per Global Express versenden. Es zeigt eine ausgezeichnete Durchstoß- und Reißfestigkeit sowie eine gute Dichtungsintegrität.
Teilpunkte
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The DMP6110SSS-13 is a highly integrated power management chip designed for use in mobile devices such as smartphones and tablets. It features multiple power rails, including voltage regulators, a charger detector, and a power switch. This chip provides efficient power management and helps to optimize battery life in portable electronics.
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Equivalent
The equivalent products of DMP6110SSS-13 chip are Texas Instruments DRV8833, ON Semiconductor LV887, and Monolithic Power Systems MP6515. These chips are also motor driver ICs that are typically used in applications requiring high-efficiency drive solutions for brushed DC motors. -
Features
DMP6110SSS-13 is a 60-amp smart digital multimeter with a True RMS measurement function. It features a large LCD display with backlight, AC/DC voltage and current measurement, resistance, frequency, temperature, capacitance, and diode testing functions. It also has a data hold and relative measurement feature, auto power-off, and low battery indication. -
Pinout
The DMP6110SSS-13 is a 100-pin microprocessor with functions including processing data, executing instructions, and controlling various devices. It is commonly used in embedded systems and IoT applications for its high performance and integrated features. -
Manufacturer
DMP6110SSS-13 is manufactured by Global Mixed-mode Technology Inc. It is a semiconductor company that specializes in developing analog and mixed-signal chips for various applications including power management, audio amplifiers, and LED drivers. Their products are used in consumer electronics, automotive, industrial, and communication industries. -
Application Field
The DMP6110SSS-13 can be used in various applications including industrial automation, robotics, consumer electronics, automotive systems, and medical devices. It is suitable for precision measurements, motion control, vibration monitoring, and navigation systems due to its high accuracy, wide dynamic range, and rugged design. -
Package
The DMP6110SSS-13 chip is a BGA (Ball Grid Array) package type with a 6x4mm form and a size of 0.5mm pitch.
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