Altera EP1C3T144I7N

Teilpunkte

• The EP1C3T144I7N chip is a programmable logic device from Altera Corporation, now a part of Intel (AKA Cyclone series). It features 3,200 logic elements, 72 Kbits of embedded memory, and 144 pins. The chip can be programmed to perform various functions and is commonly used in embedded systems and digital circuits.

• Equivalent

  The equivalent products of EP1C3T144I7N chip are Altera Cyclone FPGA series, specifically the EP1C4F324C8 and EP1C3T144C8 chips. These chips have similar properties and can be used as replacements for the EP1C3T144I7N chip in various applications.

• Features

  EP1C3T144I7N is a field-programmable gate array (FPGA) with 3,000 logic elements, 144 pins, and speed grade of 7. It offers pre-engineered intellectual property (IP) blocks, embedded memory, and multiplier functions. The device supports multiple power-saving modes and has up to 288 user I/Os for design flexibility.

• Pinout

  The EP1C3T144I7N is a field programmable gate array (FPGA) with 144 pins. It is part of the Cyclone family and has 3,136 logic elements and 18Kbits of memory. It is used for programmable logic applications such as signal processing and control systems.

• Manufacturer

  The EP1C3T144I7N is manufactured by Altera Corporation, which is a semiconductor company specializing in programmable logic devices. They design and manufacture a wide range of integrated circuits for various industries, including telecommunications, automotive, industrial, and consumer electronics. Altera was acquired by Intel Corporation in 2015 and is now known as Intel FPGA.

• Application Field

  The EP1C3T144I7N is a field-programmable gate array (FPGA) ideally used in applications such as telecommunications, networking, industrial control, and automotive systems. Its compact size, low power consumption, and versatile I/O capabilities make it suitable for various embedded system designs requiring real-time processing and high-speed data transfer.

• Package

  The EP1C3T144I7N chip comes in a fine-pitch Ball Grid Array (FBGA) package type, with a form factor of 144-pin and a size of 13x13 mm.