Altera EP2C70F896C6N

Teilpunkte

• The EP2C70F896C6N is a field-programmable gate array (FPGA) chip from Altera. It features 70,000 logic elements, over 2.1 million bits of RAM, and 343 user I/Os. The chip offers versatile programmability for a wide range of applications, such as telecommunications, automotive, and industrial automation.

• Equivalent

  Some equivalent products of the EP2C70F896C6N chip are Altera Cyclone II EP2C70F896C6, Intel Cyclone II EP2C70F896C6, and other FPGAs from the same family with similar specifications and features. These chips are commonly used for low-cost, entry-level FPGA development and prototyping.

• Features

  EP2C70F896C6N is an FPGA device from Altera's Cyclone II family. It features 70,000 logic elements (LEs), 376 embedded memory blocks, 196 embedded 18 x 18 multipliers, and a maximum of 896 user I/Os. It operates on a 1.5V core voltage and supports various I/O standards.

• Pinout

  The EP2C70F896C6N is a Field-Programmable Gate Array (FPGA) from Intel (formerly Altera) with a pin count of 896. It features 70,000 logic elements, 2060 kbits of embedded memory, and 220 DSP blocks. The device is used for implementing complex digital designs in various applications such as telecommunications, industrial automation, and signal processing.

• Manufacturer

  The EP2C70F896C6N is manufactured by Intel Corporation, a multinational technology company known for its computing and communications products. They specialize in the design and production of processors, integrated circuits, and other hardware components used in a variety of devices and systems worldwide.

• Application Field

  The EP2C70F896C6N is a field-programmable gate array (FPGA) commonly used in various applications such as industrial automation, automotive electronics, telecommunications, and aerospace. Its high processing power, programmability, and parallel processing capabilities make it ideal for applications requiring high performance, low latency, and reliability.

• Package

  The EP2C70F896C6N chip is a Field Programmable Gate Array (FPGA) in an FBGA (Fine Pitch Ball Grid Array) package. It is in the form of a silicon chip, and the size is 27 x 27 mm with a 896-ball grid array (27 x 27, 0.8mm pitch).