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TI UCC27424MDGNREP
Low-Side Gate Driver IC Non-Inverting 8-HVSSOP
Marken: TI
Herstellerteil #: UCC27424MDGNREP
Datenblatt: UCC27424MDGNREP Datenblatt (PDF)
Paket/Gehäuse: HVSSOP-8
Produktart: MOSFET & Power Driver ICs
RoHS-Status:
Lagerzustand: 2000 Stück, Neues Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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BOMUCC27424MDGNREP Allgemeine Beschreibung
The UCC27423 and UCC27424 high-speed MOSFET drivers can deliver large peak currents into capacitive loads. Two standard logic options are offered – dual inverting and dual noninverting drivers. The UCC27424 thermally-enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. The UCC27423 is offered in a standard SOIC-8 (D) package.
Using a design that inherently minimizes shoot-through current, this driver delivers 4 A of current where it is needed most – at the Miller plateau region during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.
The UCC27423 and UCC27424 provide enable (ENB) functions to better control the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which previously were left unused in the industry-standard pinout. ENBA and ENBB are pulled up internally to VDD for active-high logic and can be left open for standard operation.
Funktionen
- Industry-Standard Pinout
- Enable Functions for Each Driver
- High Current-Drive Capability of ±4 A
- Unique Bipolar and CMOS True-Drive Output
Stage Provides High Current at MOSFET Miller
Thresholds - TTL-/CMOS-Compatible Inputs Independent of
Supply Voltage - 20-ns Typical Rise and 15-ns Typical Fall Times
With 1.8-nF Load - Typical Propagation Delay Times of 25 ns
With Input Falling and 35 ns With Input Rising - 4.5-V to 15-V Supply Voltage
- Dual Outputs can be Paralleled for Higher Drive
Current - Available in Thermally-Enhanced MSOP
PowerPAD™ Package With 4.7°C/W RθJC - Supports Defense, Aerospace, and Medical
Applications- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
- APPLICATIONS
- Switch-Mode Power Supplies
- DC/DC Converters
- Motor Controllers
- Line Drivers
- Class-D Switching Amplifiers
All other trademarks are the property of their respective owners
Spezifikationen
| Parameter | Wert | Parameter | Wert |
|---|---|---|---|
| Number of channels | 2 | Power switch | IGBT, MOSFET |
| Peak output current (A) | 4 | Input VCC (min) (V) | 4.5 |
| Input VCC (max) (V) | 15 | Features | Enable pin |
| Operating temperature range (°C) | -55 to 125 | Rise time (ns) | 20 |
| Fall time (ns) | 15 | Propagation delay time (µs) | 0.025 |
| Input negative voltage (V) | 0 | Rating | HiRel Enhanced Product |
| Driver configuration | Dual inputs |
Versand
| Versandart | Versandgebühr | Vorlaufzeit | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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REGISTRIERTE LUFTPOST | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
Bearbeitungszeit: Die Versandkosten hängen von der jeweiligen Zone und dem Land ab.
Zahlung
| Zahlungsbedingungen | Handgebühr | |
|---|---|---|
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Banküberweisung | Bankgebühr in Höhe von 30,00 USD wird berechnet. |
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Paypal | 4,0 % Servicegebühr wird berechnet. |
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Kreditkarte | 3,5 % Servicegebühr wird berechnet. |
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Western Union | charge US.00 banking fee. |
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Geldgramm | Bankgebühr in Höhe von 0,00 USD wird berechnet. |
Garantien
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Verpackung
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Wir prüfen alle Waren vor dem Versand, stellen sicher, dass sich alle Produkte in gutem Zustand befinden und dass die Teile neu und original sind und mit dem Datenblatt übereinstimmen.
Nachdem alle Waren darauf überprüft wurden, dass nach dem Verpacken keine Probleme auftreten, werden wir sicher verpacken und per Global Express versenden. Es zeigt eine ausgezeichnete Durchstoß- und Reißfestigkeit sowie eine gute Dichtungsintegrität.
Teilpunkte
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The UCC27424MDGNREP chip is a high-speed, dual-channel gate driver designed for driving power MOSFETs and IGBTs in applications like motor control and power supplies. It offers high peak output current and fast switching speeds, enhancing system efficiency and reliability. Additionally, its small form factor and robust design make it suitable for various industrial and automotive applications.
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Equivalent
Equivalent products to the UCC27424MDGNREP chip include the UCC27423, UCC27425, and UCC27426 from Texas Instruments. These devices are high-speed, dual-channel MOSFET drivers with similar specifications and features. -
Features
UCC27424MDGNREP is a dual-channel, high-speed, low-side gate driver with 4-A source and sink current capabilities. It features TTL input thresholds, wide supply voltage range, matched propagation delays, and an active Miller clamp. It is suitable for use in high-frequency switching applications in power electronics. -
Pinout
The UCC27424MDGNREP is a dual-channel, high-speed, low-side gate driver IC. It has 8 pins and functions to efficiently drive power MOSFETs and IGBTs in high-frequency switching applications. The pins include input, output, and supply connections for each channel, along with ground and enable pins. -
Manufacturer
Texas Instruments is the manufacturer of the UCC27424MDGNREP. It is an American company that designs and manufactures semiconductors and integrated circuits for a variety of applications, including power management, analog, and digital signal processing. -
Application Field
The UCC27424MDGNREP is commonly used in applications requiring high-speed, high-current drive capabilities, such as power inverters, motor control, switch-mode power supplies, and DC-DC converters. Its features make it suitable for various power electronics applications where fast and efficient switching is crucial. -
Package
The UCC27424MDGNREP chip comes in a Surface Mount Package. It has a 14-Pin SOIC (Small Outline Integrated Circuit) form factor. The size of the chip is 5mm x 5mm.
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