W25Q128BVEIG
FLASH - NOR Memory IC 128Mbit SPI - Quad I/O 104 MHz 8-WSON (8x6)
Marken: WINBOND ELECTRONICS CORP
Herstellerteil #: W25Q128BVEIG
Datenblatt: W25Q128BVEIG Datenblatt (PDF)
Paket/Gehäuse: 8-WSON (8x6)
Produktart: NOR Flash
RoHS-Status:
Lagerzustand: 6741 Stück, Neues Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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BOMW25Q128BVEIG Allgemeine Beschreibung
FLASH - NOR Memory IC 128Mbit SPI - Quad I/O 104 MHz 8-WSON (8x6)
Funktionen
- Family of SpiFlash Memories
- – W25Q128BV: 128M-bit/16M-byte
- – 256-byte per programmable page
- – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
- – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
- – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
- Highest Performance Serial Flash
- – 104/70MHz Dual Output/Quad SPI clocks
- – 208/280MHz equivalent Dual /Quad SPI
- – 35MB/S continuous data transfer rate
- – Up to 5X that of ordinary Serial Flash
- – More than 100,000 erase/program cycles(1)
- – More than 20-year data retention
- Efficient “Continuous Read Mode”
- – Low Instruction overhead
- – Continuous Read with 8/16/32/64-Byte Wrap
- – As few as 8 clocks to address memory
- – Allows true XIP (execute in place) operation
- – Outperforms X16 Parallel Flash
- Low Power, Wide Temperature Range
- – Single 2.7 to 3.6V supply
- – 4mA active current, <1µA Power-down current
- – -40°C to +85°C operating range
- Flexible Architecture with 4KB sectors
- – Uniform Sector/Block Erase (4K/32K/64K-Byte)
- – Program one to 256 bytes
- – Erase/Program Suspend & Resume
- Advanced Security Features
- – Software and Hardware Write-Protect
- – Top/Bottom, 4KB complement array protection
- – Lock-Down and OTP array protection
- – 64-Bit Unique Serial Number for each device
- – Discoverable Parameters (SFDP) Register
- – 3X256-Byte Security Registers with OTP locks
- – Volatile & Non-volatile Status Register Bits
- Space Efficient Packaging
- – 8-pad WSON 8x6-mm
- – 16-pin SOIC 300-mil
- – 24-ball TFBGA 8x6-mm
- – Contact Winbond for KGD and other options
Spezifikationen
Parameter | Wert | Parameter | Wert |
---|---|---|---|
Rohs Code | Yes | Part Life Cycle Code | Obsolete |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | Part Package Code | SON |
Package Description | 8 X 6 MM, GREEN, WSON-8 | Pin Count | 8 |
Reach Compliance Code | compliant | ECCN Code | EAR99 |
HTS Code | 8542.32.00.51 | Samacsys Manufacturer | Winbond |
Clock Frequency-Max (fCLK) | 104 MHz | Data Retention Time-Min | 20 |
Endurance | 100000 Write/Erase Cycles | JESD-30 Code | R-PDSO-N8 |
Length | 8 mm | Memory Density | 134217728 bit |
Memory IC Type | FLASH | Memory Width | 1 |
Number of Functions | 1 | Number of Terminals | 8 |
Number of Words | 134217728 words | Number of Words Code | 128000000 |
Operating Mode | SYNCHRONOUS | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | Organization | 128MX1 |
Package Body Material | PLASTIC/EPOXY | Package Code | HVSON |
Package Equivalence Code | SOLCC8,.3 | Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Parallel/Serial | SERIAL |
Power Supplies | 3/3.3 V | Programming Voltage | 2.7 V |
Qualification Status | Not Qualified | Seated Height-Max | 0.8 mm |
Serial Bus Type | SPI | Standby Current-Max | 0.000015 A |
Supply Current-Max | 0.025 mA | Supply Voltage-Max (Vsup) | 3.6 V |
Supply Voltage-Min (Vsup) | 2.7 V | Supply Voltage-Nom (Vsup) | 3 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | INDUSTRIAL | Terminal Form | NO LEAD |
Terminal Pitch | 1.27 mm | Terminal Position | DUAL |
Type | NOR TYPE | Width | 6 mm |
Write Protection | HARDWARE/SOFTWARE |
Versand
Versandart | Versandgebühr | Vorlaufzeit | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 Tage | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 Tage | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 Tage | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 Tage | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 Tage | |
REGISTRIERTE LUFTPOST | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
Bearbeitungszeit: Die Versandkosten hängen von der jeweiligen Zone und dem Land ab.
Zahlung
Zahlungsbedingungen | Handgebühr | |
---|---|---|
Banküberweisung | Bankgebühr in Höhe von 30,00 USD wird berechnet. | |
Paypal | 4,0 % Servicegebühr wird berechnet. | |
Kreditkarte | 3,5 % Servicegebühr wird berechnet. | |
Western Union | charge US.00 banking fee. | |
Geldgramm | Bankgebühr in Höhe von 0,00 USD wird berechnet. |
Garantien
1. Die von Ihnen gekauften elektronischen Bauteile enthalten eine 365-tägige Garantie. Wir garantieren die Produktqualität.
2. Wenn einige der Artikel, die Sie erhalten haben, nicht von perfekter Qualität sind, würden wir verantwortungsvoll Ihre Rückerstattung oder Ersatz arrangieren. Die Artikel müssen jedoch in ihrem Originalzustand verbleiben.
Verpackung
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Schritt1 :Produkt
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Schritt2 :Vakuumverpackung
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Schritt3 :Antistatikbeutel
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Schritt4 :Individuelle Verpackung
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Schritt5 :Verpackungskartons
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Schritt6 :Barcode-Versandetikett
Alle Produkte werden in antistatischen Beuteln verpackt. Versand mit ESD-Antistatikschutz.
Auf dem äußeren ESD-Verpackungsetikett werden die Informationen unseres Unternehmens verwendet: Teilenummer, Marke und Menge.
Wir prüfen alle Waren vor dem Versand, stellen sicher, dass sich alle Produkte in gutem Zustand befinden und dass die Teile neu und original sind und mit dem Datenblatt übereinstimmen.
Nachdem alle Waren darauf überprüft wurden, dass nach dem Verpacken keine Probleme auftreten, werden wir sicher verpacken und per Global Express versenden. Es zeigt eine ausgezeichnete Durchstoß- und Reißfestigkeit sowie eine gute Dichtungsintegrität.
Teilpunkte
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The W25Q128BVEIG is a flash memory chip commonly used in electronic devices. It offers a capacity of 128 megabits and operates over a wide voltage range. The chip supports both serial and parallel interface modes, allowing for flexible integration into various applications. With high performance, reliability, and low power consumption, the W25Q128BVEIG chip is suitable for storing program code, data, and other digital content in a wide range of devices such as smartphones, tablets, automotive systems, and more.
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Equivalent
Some equivalent products to the W25Q128BVEIG chip include the W25Q128FV, W25Q128FW, and W25Q128JV. These chips are all part of the Winbond Electronics' W25Q Flash Memory series and have similar features and specifications. -
Features
W25Q128BVEIG is a flash memory chip manufactured by Winbond. It offers a storage capacity of 128Mb with a quad SPI interface. It has a fast read operation, low power consumption, and supports a wide voltage range. The chip also features multi-sector erase capability, efficient programming, and reliable performance. -
Pinout
The W25Q128BVEIG is a 8-pin serial NOR flash memory chip. It provides 128Mb of storage space and can be accessed through SPI interface. The functions of each pin are as follows: 1. CS (Chip Select) 2. DO (Data Out) 3. WP (Write Protect) 4. GND (Ground) 5. DI (Data In) 6. CLK (Clock) 7. HOLD (Hold) 8. VCC (Power Supply) -
Manufacturer
The W25Q128BVEIG is manufactured by Winbond Electronics Corporation. It is a semiconductor company specializing in the production of memory solutions, including flash memory, DRAM, and NOR flash products. -
Application Field
The W25Q128BVEIG is commonly used in applications such as consumer electronics, automotive systems, industrial equipment, networking devices, and medical devices. It is designed to provide high-performance, reliable, and cost-effective data storage solutions in a wide range of electronic devices. -
Package
The W25Q128BVEIG chip package type is SOIC (Small Outline Integrated Circuit), the form is 16-pin and the size is 200mil.
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