Intel 5CEBA4F17I7N

Teilpunkte

• The 5CEBA4F17I7N chip is a Field Programmable Gate Array (FPGA) from the Cyclone IV E family by Intel (formerly Altera). It features 4,608 logic elements, 225 Kbits of embedded memory, and other customizable components like phase-locked loops and digital signal processing blocks. The chip is designed for applications requiring high-speed data processing and flexibility in configuring hardware functionality.

• Equivalent

  Some equivalent products of the 5CEBA4F17I7N chip include the 10M08SAU169C8G, 10M16SCU324C8G, and 5CEBA4F23C8N chips. These chips are all part of the Cyclone IV E family of FPGAs produced by Intel (formerly Altera). They offer similar capabilities and performance to the 5CEBA4F17I7N chip.

• Features

  1. Low-cost, high-performance FPGA 2. 4,150 logic elements with 22,716 RAM bits 3. 224Kbits embedded memory 4. Up to 63 18x18 multipliers 5. 346Kbits of user flash memory 6. Integrated PLLs for clock management 7. Supports high-speed transceivers up to 3.4 Gbps 8. Compact packaging options for space-constrained designs

• Pinout

  The 5CEBA4F17I7N is a Cyclone V FPGA in a 484-pin fine-pitch ball grid array (FBGA) package. It has various I/O pins for interfacing with external components, power and ground pins for supplying power and reference voltage, configuration pins for programming the device, and other control and communication pins for managing the FPGA's operation.

• Manufacturer

  The manufacturer of the 5CEBA4F17I7N is Intel Corporation. Intel Corporation is an American multinational corporation that produces semiconductors and computer-related technologies. It is one of the world's largest and highest-valued semiconductor chip manufacturers.

• Application Field

  The 5CEBA4F17I7N FPGA is commonly used in the following application areas: 1. Industrial Automation 2. Automotive 3. Aerospace 4. Data Centers 5. Communications 6. Audio/Video Processing Its versatility, high performance, and low power consumption make it suitable for a wide range of demanding applications across various industries.

• Package

  The 5CEBA4F17I7N chip is housed in a FBGA (Fine-Pitch Ball Grid Array) package, has a form factor of a flat square, and measures 13mm x 13mm with a 484-ball size.