Intel EP4CE30F29C8N

Teilpunkte

• The EP4CE30F29C8N is an Altera Cyclone IV FPGA chip featuring 29,440 logic elements, 266 Kbits of RAM, and 288 multipliers. It is commonly used in high-performance computing applications, digital signal processing, and telecommunications. Its C8 package type offers 324 pins for connectivity and is ideal for mid-range FPGA design projects.

• Equivalent

  Some of the equivalent products of EP4CE30F29C8N chip are EP4CE30F23C8N, EP4CE30F29I7N, EP4CE30F29I8N, EP4CE30F17I8N, EP4CE30F17I7N, EP4CE30F29I7M, EP4CE30F29I7, EP4CE30F29E7N, or EP4CE30F29C6N. These chips are part of the same product family and offer similar functionalities and features.

• Features

  1. Cyclone IV FPGA with 29,312 logic elements 2. 654 embedded memory blocks 3. 266 user I/O pins 4. 4 PLLs 5. 588 Kbits of RAM 6. Support for up to 300 MHz operating frequency 7. Low power consumption 8. Enhanced flexibility and processing power

• Pinout

  The EP4CE30F29C8N is a Cyclone IV FPGA with 780 pins. It has functions such as programmable logic cells, memory blocks, PLLs, and transceivers for data transmission. It is designed for applications requiring high-speed data processing and flexibility in implementing complex algorithms.

• Manufacturer

  EP4CE30F29C8N is manufactured by Intel Corporation. It is a multinational technology company specializing in the design and manufacturing of semiconductor chips and other computer hardware products. Intel is one of the largest and most influential companies in the technology industry, with a wide range of products used in various applications and industries worldwide.

• Application Field

  The EP4CE30F29C8N is commonly used in applications such as telecommunications, networking, industrial automation, automotive, and consumer electronics. It is ideal for applications that require high-speed processing, advanced security features, and versatility in design implementations. It is also widely used in digital signal processing, data storage, and image processing applications.

• Package

  The EP4CE30F29C8N chip is in a Ball Grid Array (BGA) package, with a form factor of 29 x 29 mm. The size of the chip is 780 balls, with a pitch of 1 mm.