Altera EP4CE6F17I7

Teilpunkte

• The EP4CE6F17I7 is a field-programmable gate array (FPGA) chip developed by Intel (formerly Altera) as part of their Cyclone IV series. It features 6272 logic elements, can operate at speeds up to 200 MHz, and offers 272 Kbits of embedded memory. This chip is commonly used in applications that require high-speed processing and reconfigurable logic circuits.

• Equivalent

  The equivalent products of the EP4CE6F17I7 chip are EP4CE6F17I7N, EP4CE6F17I7N-6, EP4CE6F17I7LN, EP4CE6F17I7N-6N, and EP4CE6F17I7LN. These chips have similar specifications and functionalities, making them suitable replacements for the EP4CE6F17I7 chip in various applications.

• Features

  EP4CE6F17I7 features a Cyclone IV FPGA from Intel (formerly Altera), with 6272 logic elements, 270 Kbits of RAM, 18 embedded 18x18 multipliers, 67 general-purpose I/O pins, and support for various communication protocols like SPI, I2C, and UART. It also has low power consumption and is suitable for a wide range of applications.

• Pinout

  The EP4CE6F17I7 is a FPGA with 324 pins. It features 6,272 logic elements, 314,880 bits of RAM, and 179 multipliers. It is programmable for a variety of functions, including digital signal processing, image processing, and communications applications.

• Manufacturer

  The EP4CE6F17I7 is manufactured by Intel Corporation, an American multinational corporation. Intel is a technology company that designs and manufactures a variety of products including microprocessors, memory, and programmable logic devices like field-programmable gate arrays (FPGAs) like the EP4CE6F17I7.

• Application Field

  The EP4CE6F17I7 FPGA is commonly utilized in a variety of applications, including industrial automation, automotive electronics, telecommunications, medical devices, and consumer electronics. It is suitable for applications requiring high-speed data processing, low power consumption, and flexibility to accommodate various functions and features.

• Package

  The EP4CE6F17I7 chip comes in a 176-pin fine-pitch ball grid array (FBGA) package with a size of 17x17 mm and a form factor of 0.8 mm pitch.