Bestellungen über
$5000NXP MPC860TCVR66D4
Microprocessors - MPU POWER QUICC-NO LEAD
Marken: NXP Semiconductor
Herstellerteil #: MPC860TCVR66D4
Datenblatt: MPC860TCVR66D4 Datasheet (PDF)
Paket/Gehäuse: BGA-357
RoHS-Status:
Lagerzustand: 3.536 Stück, Neues Original
Produktart: Microprocessors
Warranty: 1 Year Ovaga Warranty - Find Out More
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1
*Alle Preise sind in USD
Menge | Einzelpreis | Ext. Preis |
---|---|---|
1 | $590,714 | $590,714 |
220 | $228,599 | $50291,780 |
484 | $220,565 | $106753,460 |
1012 | $216,594 | $219193,128 |
Auf Lager: 3.536 Stck
MPC860TCVR66D4 Allgemeine Beschreibung
The MPC860TCVR66D4 stands out as a powerhouse within the PowerPC family, tailor-made for embedded applications that demand nothing short of top-tier performance. Boasting a clock speed of 66 MHz and built on the robust PowerPC 603e core, this processor is primed to deliver exceptional results for its designated functions. Equipped with a 32-bit architecture and an integrated floating-point unit (FPU), it excels in handling complex numerical tasks with unparalleled efficiency. Moreover, the MPC860TCVR66D4 is furnished with a diverse array of peripheral interfaces including UART, SPI, I2C, and Ethernet, ensuring seamless connectivity options for embedded systems. Its on-chip memory management unit (MMU) support further enhances performance by streamlining memory access and management for multitasking operating systems. Unquestionably, this processor is the ideal choice for a wide spectrum of embedded applications ranging from industrial control systems to networking equipment and automotive electronics, where steadfast reliability and real-time performance are imperative
Funktionen
- This PowerQUICC processor integrates multiple functions onto a single chip
- The MPC860TCVR66D4 is a highly integrated processor with enhanced communication capabilities
- It features advanced peripherals and memory management units for efficient data transfer
- This powerful processor has on-chip serial interfaces, DMA controllers, and memory management
- The MPC860TCVR66D4 processor combines multiple functions onto one chip for improved performance
- This highly integrated processor integrates many functions including memory management
Anwendung
- Automotive systems
- for its
- performance
Spezifikationen
Parameter | Wert | Parameter | Wert |
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Pin Count | 357 | Package Category | BGA |
Released Date | Mar 14, 2023 |
Versand
Versandart | Versandgebühr | Vorlaufzeit | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 Tage | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 Tage | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 Tage | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 Tage | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 Tage | |
REGISTRIERTE LUFTPOST | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
Bearbeitungszeit: Die Versandkosten hängen von der jeweiligen Zone und dem Land ab.
Zahlung
Zahlungsbedingungen | Handgebühr | |
---|---|---|
Banküberweisung | Bankgebühr in Höhe von 30,00 USD wird berechnet. | |
Paypal | 4,0 % Servicegebühr wird berechnet. | |
Kreditkarte | 3,5 % Servicegebühr wird berechnet. | |
Western Union | charge US.00 banking fee. | |
Geldgramm | Bankgebühr in Höhe von 0,00 USD wird berechnet. |
Garantien
1. Die von Ihnen gekauften elektronischen Bauteile enthalten eine 365-tägige Garantie. Wir garantieren die Produktqualität.
2. Wenn einige der Artikel, die Sie erhalten haben, nicht von perfekter Qualität sind, würden wir verantwortungsvoll Ihre Rückerstattung oder Ersatz arrangieren. Die Artikel müssen jedoch in ihrem Originalzustand verbleiben.
Verpackung
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Schritt1 :Produkt
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Schritt2 :Vakuumverpackung
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Schritt3 :Antistatikbeutel
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Schritt4 :Individuelle Verpackung
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Schritt5 :Verpackungskartons
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Schritt6 :Barcode-Versandetikett
Alle Produkte werden in antistatischen Beuteln verpackt. Versand mit ESD-Antistatikschutz.
Auf dem äußeren ESD-Verpackungsetikett werden die Informationen unseres Unternehmens verwendet: Teilenummer, Marke und Menge.
Wir prüfen alle Waren vor dem Versand, stellen sicher, dass sich alle Produkte in gutem Zustand befinden und dass die Teile neu und original sind und mit dem Datenblatt übereinstimmen.
Nachdem alle Waren darauf überprüft wurden, dass nach dem Verpacken keine Probleme auftreten, werden wir sicher verpacken und per Global Express versenden. Es zeigt eine ausgezeichnete Durchstoß- und Reißfestigkeit sowie eine gute Dichtungsintegrität.
Teilpunkte
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The MPC860TCVR66D4 chip is a PowerQUICC II Pro processor that features a dual-core architecture and is designed for networking applications. It offers a high level of integration, including a system controller, security engine, Ethernet interface, and Fast Ethernet MACs. The chip is known for its reliability, performance, and flexibility in networking environments.
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Features
The MPC860TCVR66D4 is a microprocessor with a PowerPC architecture. It features a clock speed of 66 MHz, a dual-issue, superscalar core, and a 32-bit internal data bus. It also has integrated peripherals, including a memory controller, a time base, and a communication controller, making it suitable for embedded systems applications. -
Pinout
The MPC860TCVR66D4 has 196 pins and is a microprocessing unit from the PowerPC 8xx family. It is commonly used in embedded systems and features a 66 MHz clock speed. The pins serve various functions, including data and address bus connections, control signals, clock inputs, and power and ground connections. -
Manufacturer
The manufacturer of the MPC860TCVR66D4 is NXP Semiconductors. NXP is a semiconductor and software company that provides solutions for automotive, industrial, mobile, and communication sectors. They specialize in high-performance mixed-signal electronics and are known for their expertise in developing secure connectivity solutions, microcontrollers, and integrated circuits. -
Application Field
The MPC860TCVR66D4 is a microprocessor commonly used in embedded systems and telecommunication applications. It is suited for various application areas such as network routers, switches, industrial control systems, automotive systems, and telecommunications infrastructure. Its features and capabilities make it suitable for real-time, high-performance computing in these diverse fields. -
Package
The MPC860TCVR66D4 chip is in a 256-BBGA package type, with a ball grid array (BGA) form, and its size is 17mm x 17mm.
Datenblatt PDF
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