S25FL128SAGBHIZ00

S25FL128SAGBHIZ00 Allgemeine Beschreibung

The S25FL128SAGBHIZ00 is a cutting-edge flash memory chip manufactured by Cypress Semiconductor. Boasting a capacity of 128 megabits, it provides high-performance storage for a variety of applications, including embedded systems, automotive electronics, networking equipment, and consumer electronics. Its Serial Peripheral Interface (SPI) enables fast and flexible communication with microcontrollers and other digital devices, ensuring seamless integration. With high-speed read and write operations, rapid access to data is guaranteed, while advanced features like sector erase and partial block programming enhance flexibility and efficiency in data management. Moreover, this flash memory chip incorporates built-in security features, including hardware-based protection and secure boot capabilities, to safeguard sensitive information and ensure data integrity

Funktionen

• Density
• – 128 Mbits (16 Mbytes)
• – 256 Mbits (32 Mbytes)
• Serial Peripheral Interface (SPI)
• – SPI Clock polarity and phase modes 0 and 3
• – Double Data Rate (DDR) option
• – Extended Addressing: 24- or 32-bit address options
• – Serial Command set and footprint compatible with S25FL-A,
• S25FL-K, and S25FL-P SPI families
• – Multi I/O Command set and footprint compatible with
• S25FL-P SPI family
• READ Commands
• – Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad DDR
• – AutoBoot - power up or reset and execute a Normal or Quad read
• command automatically at a preselected address
• – Common Flash Interface (CFI) data for configuration information.
• Programming (1.5 Mbytes/s)
• – 256 or 512 Byte Page Programming buffer options
• – Quad-Input Page Programming (QPP) for slow clock systems
• Erase (0.5 to 0.65 Mbytes/s)
• – Hybrid sector size option - physical set of thirty two 4-kbyte sectors
• at top or bottom of address space with all remaining sectors of
• 64 kbytes, for compatibility with prior generation S25FL devices
• – Uniform sector option - always erase 256-kbyte blocks for software
• compatibility with higher density and future devices.
• Cycling Endurance
• – 100,000 Program-Erase Cycles on any sector typical
• Data Retention
• – 20 Year Data Retention typical
• Security features
• – One Time Program (OTP) array of 1024 bytes
• – Block Protection:
• – Status Register bits to control protection against program or
• erase of a contiguous range of sectors.
• – Hardware and software control options
• – Advanced Sector Protection (ASP)
• – Individual sector protection controlled by boot code or password
• Spansion® 65 nm MirrorBit Technology with Eclipse™ Architecture
• Core Supply Voltage: 2.7V to 3.6V
• I/O Supply Voltage: 1.65V to 3.6V
• – SO16 and FBGA packages
• Temperature Range:
• – Industrial (-40°C to +85°C)
• – Automotive In-Cabin (-40°C to +105°C)
• Packages (all Pb-free)
• – 16-lead SOIC (300 mil)
• – WSON 6 x 8 mm
• – BGA-24 6 x 8 mm
• – 5 x 5 ball (FAB024) and 4 x 6 ball (FAC024) footprint options
• – Known Good Die and Known Tested Die

Spezifikationen