Xilinx XC6SLX150-3FGG900C

Teilpunkte

• XC6SLX150-3FGG900C is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It belongs to the Spartan-6 family and offers 147,443 logic cells and 448 block RAMs. The chip operates at a maximum frequency of 500 MHz and is designed for various applications, including telecommunications, embedded systems, and consumer electronics.

• Equivalent

  Some equivalent products of the XC6SLX150-3FGG900C chip include XC6SLX150T-3FGG1156C, XC6SLX150T-3FGG484C, XC6SLX150T-3FGG900C, and XC6SLX150T-3FGG484I.

• Features

  The XC6SLX150-3FGG900C is an FPGA chip manufactured by Xilinx. It has 147,443 logic cells, 526 multipliers, 1,344KB of block RAM, 400MHz clock frequency, and 900 ball grid array (BGA) package. It is suitable for various applications requiring high-performance computing, data processing, and signal processing.

• Pinout

  The XC6SLX150-3FGG900C is a Field Programmable Gate Array (FPGA) with a BGA package. It has a pin count of 900. The specific pin functions can vary depending on the configuration, but generally, FPGAs are used for digital logic functions and can be programmed to perform a wide range of tasks.

• Manufacturer

  The manufacturer of the XC6SLX150-3FGG900C is Xilinx. Xilinx is an American technology company that specializes in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs).

• Application Field

  The XC6SLX150-3FGG900C is a Field-Programmable Gate Array (FPGA) chip. It can be used in a wide range of applications, including aerospace and defense, automotive, industrial control, medical devices, telecommunications, and video processing. Its high performance, low power consumption, and flexibility make it suitable for various complex digital systems.

• Package

  The XC6SLX150-3FGG900C chip is packaged in a Flip Chip Ball Grid Array (FCBGA) package. It features a size of 900 micrometers by 900 micrometers.