Xilinx XC7A200T-2FFG1156C

Teilpunkte

• The XC7A200T-2FFG1156C chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It is a high-performance device with a capacity of 200,000 logic cells. The chip offers advanced features such as integrated PCIe and gigabit transceivers, making it suitable for a wide range of applications including aerospace, defense, telecommunications, and industrial automation.

• Equivalent

  Some equivalent products of the XC7A200T-2FFG1156C chip include the Xilinx XC7A200T-2FBG676C and the Xilinx XC7A200T-2SBG484C chips. These chips offer similar features and functionalities to the XC7A200T-2FFG1156C chip.

• Features

  XC7A200T-2FFG1156C is an FPGA (Field Programmable Gate Array) device with 215,360 logic cells and 9.3 Mb of RAM. It has a maximum capacity of 648 I/O pins, supports various communication protocols, and can operate at high speeds with low power consumption. It is commonly used in applications such as aerospace, automotive, and telecommunications.

• Pinout

  The XC7A200T-2FFG1156C is a field-programmable gate array (FPGA) from Xilinx. It has 1156 pins and belongs to the Artix-7 family. The specific function of each pin can vary depending on the configuration and design implemented by the user.

• Manufacturer

  Xilinx Inc. is the manufacturer of the XC7A200T-2FFG1156C. It is an American technology company that specializes in the design and development of programmable logic devices and associated programming tools. Xilinx is widely recognized as a leading provider of field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs) for various industries including aerospace, automotive, telecommunications, and data centers.

• Application Field

  The XC7A200T-2FFG1156C is a field-programmable gate array (FPGA) that can be used in various application areas, including automotive electronics, industrial automation, aerospace and defense, telecommunications, and medical equipment. Its high-performance capabilities, low power consumption, and flexibility make it suitable for a wide range of applications.

• Package

  The XC7A200T-2FFG1156C chip is available in a flip-chip fine-pitch ball grid array (FCBGA) package. It has a form factor of 1156-pin and a size of 31mm x 31mm.