Xilinx XCKU060-2FFVA1156E

Teilpunkte

• The XCKU060-2FFVA1156E is a high-performance field-programmable gate array (FPGA) chip from Xilinx. It features a 20nm process technology, up to 673,280 logic cells, and 3600 DSP slices. This chip is ideal for applications requiring high-speed processing capabilities and flexible programmability.

• Equivalent

  XCKU060-2FFVA1156E chip is equivalent to XCKU060-2FFVA1156I, XCKU095-2FFVA1156E, and XCKU095-2FFVA1156I chips from the same manufacturer.

• Features

  The XCKU060-2FFVA1156E is a Xilinx Kintex UltraScale FPGA with 196,000 logic cells, 6.6 Mb of RAM, 2400 DSP slices, and 60 12.5 Gb/s transceivers. It features a -2 speed grade and is available in a FFVA1156 package. This FPGA is ideal for high-performance applications requiring extensive processing capabilities.

• Pinout

  The XCKU060-2FFVA1156E is a Xilinx Kintex UltraScale FPGA with 1156 pins. It is a high-end FPGA offering high-performance processing and interfacing capabilities for various applications such as telecommunications, automotive, and industrial.

• Manufacturer

  The manufacturer of XCKU060-2FFVA1156E is Xilinx, Inc. It is an American technology company that specializes in developing and manufacturing programmable logic devices and associated technologies. Xilinx is a leading provider of field-programmable gate arrays (FPGAs) and related software tools to enable customers to design and implement advanced digital systems.

• Application Field

  Industrial control, automotive, aerospace, telecommunications, data processing, medical equipment, and defense applications. The XCKU060-2FFVA1156E is a high-performance FPGA suitable for a wide range of applications that require high processing power, low latency, and flexibility for customization and reconfiguration.

• Package

  The XCKU060-2FFVA1156E chip is packaged in a Flip Chip Ball Grid Array (FFVA) package. It is in form factor 1156-FCBGA and has a size of 31mm x 31mm.