Intel EP4CE40F23C7N

Teilpunkte

• EP4CE40F23C7N is an integrated circuit chip, specifically a field-programmable gate array (FPGA). It is manufactured by Altera, now owned by Intel. This chip is commonly used in various electronic devices and applications. It offers a range of features and capabilities, including reprogrammable logic blocks, high-speed I/O interfaces, embedded memory, and configuration via serial interface.

• Equivalent

  Some equivalent products of EP4CE40F23C7N chip are EP4CE40F29C8N, EP4CE40F29I7N, and EP4CE40F29C7N.

• Features

  EP4CE40F23C7N is a Cyclone IV FPGA with 39,600 logic elements, 162 embedded 18x18 multipliers, 4 fractional PLLs, and 291 on-chip memory blocks. It operates at a maximum frequency of 475MHz and is built on a 40nm process. It supports various interfaces such as LVDS, PCI Express, and DDR3 memory.

• Pinout

  The EP4CE40F23C7N is a Field Programmable Gate Array (FPGA) with a pin count of 484, meaning it has 484 external pins for connecting to external devices or circuits. Its function is to perform data processing and control tasks in electronic systems, and it can be programmed or configured to perform various functions based on the specific application requirements.

• Manufacturer

  The manufacturer of the EP4CE40F23C7N is Intel. Intel is a multinational technology company that specializes in the design and manufacturing of semiconductors, including programmable logic devices like the EP4CE40F23C7N. They are known for their advancements in microprocessor technology and have a wide range of products and services in the field of computer and communication devices.

• Application Field

  The EP4CE40F23C7N FPGA can be used in various application areas such as telecommunications, industrial automation, automotive, medical equipment, and aerospace. It offers high performance and versatility, making it suitable for a wide range of applications that require programmable logic for data processing, control systems, signal processing, and more.

• Package

  The EP4CE40F23C7N chip has a package type of FBGA (Fine-Pitch Ball Grid Array), a form factor of 23mm x 23mm, and a package size of 484 balls.