Intel RC28F128J3C150
16M x 8/8M x 16 Parallel NOR Flash Memory
Marken: Intel
Herstellerteil #: RC28F128J3C150
Datenblatt: RC28F128J3C150 Datasheet (PDF)
Paket/Gehäuse: EZBGA
Produktart: Integrated Circuits (ICs)
RoHS-Status:
Lagerzustand: 2958 Stück, Neues Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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BOMRC28F128J3C150 Allgemeine Beschreibung
The RC28F128J3C150 is a flash memory device manufactured by Intel. It is part of the 28F Series of parallel NOR Flash memory products and offers a high level of reliability and performance. Key details of the RC28F128J3C150 include a memory capacity of 128 megabits (16 megabytes), organized into 16 sectors of 256K bytes each. It features a 1.8V/3V power supply, with a page size of 512 bytes and a block erase size of 16K bytes. The device is designed for a wide operational temperature range of -40°C to 85°C.The RC28F128J3C150 is ideal for applications where high performance and reliability are crucial, such as automotive, industrial, and networking systems. It offers fast read and program times, as well as high endurance and data retention capabilities.In terms of packaging, the RC28F128J3C150 is housed in a 64-ball Fortified BGA (FBGA) package, which provides a compact and reliable solution for mounting the device onto printed circuit boards.
Funktionen
- 128Mb capacity
- 3V voltage
- 150ns access time
- Compatible with parallel NOR flash interface
- Operates in industrial temperature range
- Low power consumption
- High reliability and endurance
- Available in a 56-pin TSOP package
Anwendung
- Industrial automation
- Consumer electronics
- Telecommunications
- Medical devices
- Automotive systems
- Smart appliances
- Networking equipment
- Security systems
- Gaming consoles
- Military applications
Spezifikationen
Parameter | Wert | Parameter | Wert |
---|---|---|---|
ECCN (US) | 3A991.b.1.a | Part Status | Obsolete |
Automotive | No | PPAP | No |
Cell Type | NOR | Chip Density (bit) | 128M |
Architecture | Sectored | Boot Block | No |
Block Organization | Symmetrical | Address Bus Width (bit) | 24/23 |
Sector Size | 128Kbyte x 128 | Page Size | 4Words/8Words |
Number of Bits/Word (bit) | 8/16 | Number of Words | 16M/8M |
Programmability | Yes | Timing Type | Asynchronous |
Max. Access Time (ns) | 150 | Maximum Erase Time (s) | 5/Block |
Maximum Page Access Time (ns) | 25 | Maximum Programming Time (ms) | 0.63/Byte |
OE Access Time (ns) | 25 | Process Technology | CMOS |
Interface Type | Parallel | Minimum Operating Supply Voltage (V) | 2.7 |
Typical Operating Supply Voltage (V) | 3|3.3 | Maximum Operating Supply Voltage (V) | 3.6 |
Programming Voltage (V) | 2.7 to 3.6 | Page Read Current (mA) | 54 |
Minimum Operating Temperature (°C) | -40 | Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Extended | Command Compatible | No |
ECC Support | No | Support of Page Mode | Yes |
Packaging | Tray | Mounting | Surface Mount |
Package Height | 0.78 | Package Width | 10 |
Package Length | 13 | PCB changed | 64 |
Standard Package Name | BGA | Supplier Package | EZBGA |
Pin Count | 64 |
Versand
Versandart | Versandgebühr | Vorlaufzeit | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 Tage | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 Tage | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 Tage | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 Tage | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 Tage | |
REGISTRIERTE LUFTPOST | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
Bearbeitungszeit: Die Versandkosten hängen von der jeweiligen Zone und dem Land ab.
Zahlung
Zahlungsbedingungen | Handgebühr | |
---|---|---|
Banküberweisung | Bankgebühr in Höhe von 30,00 USD wird berechnet. | |
Paypal | 4,0 % Servicegebühr wird berechnet. | |
Kreditkarte | 3,5 % Servicegebühr wird berechnet. | |
Western Union | charge US.00 banking fee. | |
Geldgramm | Bankgebühr in Höhe von 0,00 USD wird berechnet. |
Garantien
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Verpackung
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Schritt3 :Antistatikbeutel
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Schritt4 :Individuelle Verpackung
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Schritt6 :Barcode-Versandetikett
Alle Produkte werden in antistatischen Beuteln verpackt. Versand mit ESD-Antistatikschutz.
Auf dem äußeren ESD-Verpackungsetikett werden die Informationen unseres Unternehmens verwendet: Teilenummer, Marke und Menge.
Wir prüfen alle Waren vor dem Versand, stellen sicher, dass sich alle Produkte in gutem Zustand befinden und dass die Teile neu und original sind und mit dem Datenblatt übereinstimmen.
Nachdem alle Waren darauf überprüft wurden, dass nach dem Verpacken keine Probleme auftreten, werden wir sicher verpacken und per Global Express versenden. Es zeigt eine ausgezeichnete Durchstoß- und Reißfestigkeit sowie eine gute Dichtungsintegrität.
Teilpunkte
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The RC28F128J3C150 is a flash memory chip manufactured by Intel. It has a storage capacity of 128 megabits and operates at a maximum clock frequency of 150 MHz. This chip is commonly used in embedded systems and industrial applications where non-volatile memory is required for program storage.
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Equivalent
The equivalent products of the RC28F128J3C150 chip are the Micron N28F128J3A150, the Macronix MX28F128J3C150, and the Samsung KS28F128J3C150. These chips are all flash memory products with similar specifications and features. -
Features
RC28F128J3C150 is a NOR flash memory chip with a capacity of 128MB. It operates on a voltage of 1.7V to 1.95V and has a maximum clock frequency of 133MHz. It has a 2K-word block erase capability and a 64-word page programming capability. It also has a 100,000-cycle endurance rating. -
Pinout
The RC28F128J3C150 is a 150 MHz, 128 Mb NOR Flash memory with a 64-bit 2.5 V interface. It has a 64-ball Fine-pitch Ball Grid Array (FBGA) package with a 0.75 mm pitch. The pin count is 64, and it provides non-volatile storage for embedded systems and other applications. -
Manufacturer
The manufacturer of the RC28F128J3C150 is Intel Corporation. It is an American multinational corporation that develops and manufactures microprocessors, integrated circuits, and other computer-related technologies. Intel is one of the largest semiconductor chip makers in the world and supplies components for a wide range of electronic devices including PCs, smartphones, and servers. -
Application Field
The RC28F128J3C150 is commonly used in networking equipment, telecommunications systems, industrial automation, automotive applications, and medical devices. It is also suitable for use in embedded systems, consumer electronics, and other applications that require high performance and reliable non-volatile storage solutions. -
Package
The RC28F128J3C150 chip comes in a BGA package type with a 90-ball grid array form. It has a size of 8mm x 9mm x 1.0mm.
Datenblatt PDF
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