Xilinx XC2V1000-4FG456I

Teilpunkte

• The XC2V1000-4FG456I is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It is designed for general-purpose computing applications and offers a significant number of logic cells, input/output pins, and programmable interconnects. The chip operates at a maximum frequency of 260 MHz and has a capacity of 1 million system gates. It is commonly used in various industries, including telecommunications, automotive, and aerospace.

• Equivalent

  There are no direct equivalent products to the XC2V1000-4FG456I chip. However, alternative options may include similar FPGA chips, such as the Virtex II series or other FPGA families from different manufacturers like Altera or Lattice Semiconductor.

• Features

  The XC2V1000-4FG456I is a FPGA (Field-Programmable Gate Array) from Xilinx. It has 1,000,000 system gates, supports 4-input Look-Up Tables, has 7,200 logic cells, 32 CLBs (Configurable Logic Blocks), and 24,840 slices. It operates on a 1.8V core voltage and offers various performance features for versatile system designs.

• Pinout

  The XC2V1000-4FG456I is a field-programmable gate array (FPGA) with a pin count of 456. It is used for digital circuit design and implementation, featuring 1,000,000 system gates and 76 I/Os. The "4FG" indicates a 4 ns pin-to-pin delay time.

• Manufacturer

  The manufacturer of the XC2V1000-4FG456I is Xilinx Inc. It is a semiconductor manufacturing company that specializes in developing and producing programmable logic devices and other related technologies for various industries like aerospace, automotive, telecommunications, and consumer electronics.

• Application Field

  The XC2V1000-4FG456I is a field-programmable gate array (FPGA) that can be used in various application areas such as aerospace and defense, telecommunications, industrial automation, image and signal processing, and embedded systems. Its versatility allows it to be utilized in a wide range of applications where customizable hardware acceleration and high-performance computation are needed.

• Package

  The XC2V1000-4FG456I chip is packaged in a Fine-pitch Ball Grid Array (FBGA) package. It has 456 pins and its dimensions are 17mm x 17mm.