Xilinx XC3S1200E-5FTG256C

Teilpunkte

• The XC3S1200E-5FTG256C chip is a Field-Programmable Gate Array (FPGA) device manufactured by Xilinx. It belongs to the Spartan-3E family and has a density of 1.2 million system gates. It features a 5V tolerant I/O and 256-pin package. The chip offers high performance and flexibility for various digital applications, allowing designers to program and customize its functionality according to their requirements.

• Equivalent

  Some equivalent products of the XC3S1200E-5FTG256C chip include Xilinx Spartan-3E XC3S1200E-5FTG256I, XC3S1200E-4FTG256I, XC3S500E-4FTG256C, and XC3S250E-4FTG256C. These chips offer similar features and performance capabilities.

• Features

  XC3S1200E-5FTG256C is an FPGA (Field-Programmable Gate Array) device from Xilinx. It has 1,200,000 system gates, a maximum of 1,152 I/O pins, and operates at a maximum frequency of 500 MHz. It includes advanced features like embedded multipliers, block RAMs, and a microprocessor core. It is suitable for a wide range of applications, from telecommunications to industrial automation.

• Pinout

  The XC3S1200E-5FTG256C is a field-programmable gate array (FPGA) with 256 pins. It belongs to the Spartan-3E family and has 1200K system gates, 1.2V core voltage, and 5ms maximum system clock frequency. It is commonly used in digital circuit design and development.

• Manufacturer

  The manufacturer of the XC3S1200E-5FTG256C is Xilinx, Inc. It is a technology company specializing in the manufacture of field-programmable gate arrays (FPGAs) and programmable logic devices (PLDs). FPGAs are integrated circuits that can be customized and reprogrammed after manufacturing, making them suitable for a wide range of applications in various industries.

• Application Field

  The XC3S1200E-5FTG256C is an FPGA (Field-Programmable Gate Array) chip that can be used in various applications such as telecommunications, networking, industrial automation, automotive electronics, and consumer electronics. It is suitable for applications that require high-performance processing, low power consumption, and flexibility for customization.

• Package

  The XC3S1200E-5FTG256C chip is in the FG256 package type, the form is grid array, and the size is 17mm x 17mm.