Xilinx XC3S1500-4FGG456I

Teilpunkte

• The XC3S1500-4FGG456I chip is a field-programmable gate array (FPGA) produced by Xilinx. It belongs to the Spartan-3 FPGA family and has a capacity of 1,536 logic cells. The chip operates at a maximum frequency of 333 MHz and features advanced on-chip functions like digital clock managers and phase-locked loops. It is commonly used in various industrial and engineering applications for its flexibility and programmability.

• Equivalent

  Some equivalent products of the XC3S1500-4FGG456I chip are Xilinx Spartan-3A, Xilinx Spartan-3AN, and Xilinx Spartan-6.

• Features

  The XC3S1500-4FGG456I is an FPGA (Field-Programmable Gate Array) with 1,536 Kbits dual-port RAM, 5V tolerant I/O pins, 1.5M system gates, 1500 slices, 36 DSP48 slices, and 32 global clock and reset networks. It operates at a maximum frequency of 457 MHz and has a package size of FGG456.

• Pinout

  The XC3S1500-4FGG456I is an FPGA (Field-Programmable Gate Array) with a 456-pin BGA (Ball Grid Array) package. It has 1500 logic cells and operates on a 4-input Look-Up Table (LUT) architecture. The specific pin functions can vary depending on the configuration of the FPGA.

• Manufacturer

  Xilinx is the manufacturer of the XC3S1500-4FGG456I. It is a technology company specializing in programmable logic devices, including field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs).

• Application Field

  The XC3S1500-4FGG456I FPGA is commonly used in various applications such as industrial automation, telecommunications, automotive systems, medical equipment, and aerospace. Its capabilities make it suitable for complex digital designs, data processing, image processing, and real-time applications that require fast performance and high reliability.

• Package

  The package type of the XC3S1500-4FGG456I chip is FBGA (Fine-Pitch Ball Grid Array). The form is BGA (Ball Grid Array), and the size is 27mm x 27mm (456 ball count).