Xilinx XC7Z045-1FFG676I

Teilpunkte

• The XC7Z045-1FFG676I is a System-on-Chip (SoC) device from Xilinx featuring a dual-core ARM Cortex-A9 processor and programmable logic fabric. It integrates processing, memory, and I/O interfaces into a single chip, making it ideal for applications requiring high performance and flexibility. The chip is commonly used in industrial automation, medical imaging, and automotive control systems.

• Equivalent

  Some equivalent products of the XC7Z045-1FFG676I chip are Xilinx Zynq-7045, XC7Z045-2FFG676I, and Zynq-7000 series devices with similar specifications and features.

• Features

  XC7Z045-1FFG676I is an Artix-7 family FPGA with 350,000 logic cells, 885 I/Os, 57500 LUTs, and 114 36-kbit block RAMs. It supports a maximum of 6.6 Gb/s GTP transceivers and has a DDR3 SDRAM interface, PCIe Gen2, and USB 2.0. The device operates at a speed grade of -1 and is packaged in a 676-pin FFG676.

• Pinout

  The XC7Z045-1FFG676I is a Xilinx Zynq-7000 series programmable system-on-chip (SoC) with a pin count of 676 in a flip-chip package. It features a dual-core ARM Cortex-A9 processor, programmable logic fabric, and various interfaces for versatile functionality in embedded systems.

• Manufacturer

  The manufacturer of XC7Z045-1FFG676I is Xilinx. Xilinx is an American technology company that specializes in programmable devices and associated technologies, including FPGAs (Field-Programmable Gate Arrays) and SoCs (System on Chips). They are known for their advanced programmable logic devices used in various industries such as automotive, aerospace, telecommunications, and data centers.

• Application Field

  The XC7Z045-1FFG676I is commonly used in applications including embedded systems, industrial automation, telecommunications, networking, and automotive. It provides high-speed processing, FPGA programmability, and flexibility to handle complex algorithms and data processing tasks required in these industries.

• Package

  The XC7Z045-1FFG676I chip is a Field Programmable Gate Array (FPGA) package with a Ball Grid Array (BGA) form. It has 676 pins and measures 27 x 27 mm in size.