Xilinx XCV50-6BG256C

Teilpunkte

• The XCV50-6BG256C chip is a field-programmable gate array (FPGA) by Xilinx. It offers 50,000 logic cells and can be used for various applications requiring high-performance processing. With a 6-speed grade, it provides enhanced performance and flexibility. The chip is housed in a 256-ball grid array (BGA) package, making it suitable for compact designs and low-power applications.

• Equivalent

  There are no direct equivalent products to the XCV50-6BG256C chip. However, you may look for similar devices like XCV50, Virtex-I E FPGAs, or other members of the Xilinx Virtex-I E FPGA family that offer similar features and capabilities.

• Features

  The XCV50-6BG256C is a field-programmable gate array (FPGA) with 50,000 logic cells, a 1360 MHz maximum operating frequency, 256 I/O pins, 18-bit input/output width, and 6,000 CLBs (Configurable Logic Blocks). It offers high-performance and flexible programmability for various applications in industries like telecommunications, automotive, and aerospace.

• Pinout

  The XCV50-6BG256C has 256 pins. It is an FPGA (Field-Programmable Gate Array) with 50,000 logic cells and a speed grade of -6. It has various functions, including digital signal processing, high-speed communication interfaces, and general-purpose logic applications.

• Manufacturer

  The manufacturer of the XCV50-6BG256C is Xilinx Inc. Xilinx Inc. is a semiconductor company that specializes in the development and production of programmable logic devices, including Field-Programmable Gate Arrays (FPGAs). They provide programmable platforms and solutions that enable a wide range of applications, such as data centers, embedded systems, and aerospace/defense projects.

• Application Field

  The XCV50-6BG256C FPGA is commonly used in various application areas including telecommunications, industrial automation, automotive, aerospace, and defense sectors. It is specifically designed for high-performance applications that require programmable logic flexibility and advanced processing capabilities.

• Package

  The XCV50-6BG256C chip package type is BGA (Ball Grid Array), form factor is 256-BGA (17x17), and the size is 256-ball with a pitch of 1 mm.