Xilinx XCZU11EG-L1FFVC1156I

Teilpunkte

• The XCZU11EG-L1FFVC1156I is a highly advanced system on chip (SoC) from Xilinx's Zynq UltraScale+ family. It combines a powerful quad-core 64-bit ARM Cortex-A53 processor with programmable logic in a single device, making it ideal for high-performance applications in sectors such as aerospace, automotive, and telecommunications.

• Equivalent

  Equivalent products of XCZU11EG-L1FFVC1156I chip include XCZU11EG-1FFVC1156I, XCZU11CG-L1FFVC1156I, and XCZU11CG-LFFVC1156I. These chips have similar features, performance, and compatibility for use in FPGA-based applications.

• Features

  XCZU11EG-L1FFVC1156I is a Zynq UltraScale+ MPSoC with 8 ARM Cortex-A53 cores, Mali-400 MP2 GPU, 16nm FinFET+ processing technology, and 1.2V core voltage. It features 80 DSP slices with 2.4 TFLOPs of compute performance, 2.33 Mb of BRAM, 270K LUTs, and 652 Kb of UltraRAM. It also supports DDR4 memory, PCIe Gen3, and Gigabit Ethernet.

• Pinout

  XCZU11EG-L1FFVC1156I is a RFSoC device with a pin count of 1156. It features a combination of programmable logic, ARM processors, and analog interfaces for high-speed data processing and connectivity in wireless systems.

• Manufacturer

  XCZU11EG-L1FFVC1156I is manufactured by Xilinx, a technology company known for designing and producing programmable devices and associated technologies. Xilinx specializes in the development of field-programmable gate arrays (FPGAs) and has a strong presence in the semiconductor industry.

• Application Field

  XCZU11EG-L1FFVC1156I is commonly used in applications such as data centers, networking, telecommunications, automotive, and aerospace. It is ideal for high-performance computing tasks, including image and signal processing, machine learning, and artificial intelligence. Its versatility and advanced features make it well-suited for a wide range of industrial and commercial applications.

• Package

  The XCZU11EG-L1FFVC1156I chip is in a flip-chip ball grid array (FBGA) package with a size of 35mm x 35mm.