Xilinx XCZU6CG-2FFVB1156I

Teilpunkte

• The XCZU6CG-2FFVB1156I is a Zynq UltraScale+ MPSoC chip from Xilinx, featuring a combination of FPGA fabric and ARM processor cores. It is designed for applications requiring high-performance processing, programmable logic, and integrated connectivity capabilities. The chip is ideal for a wide range of applications such as automotive, industrial automation, and networking.

• Equivalent

  The equivalent products of the XCZU6CG-2FFVB1156I chip are Xilinx's Zynq UltraScale+ XCZU7CG-2FFVC1156I, XCZU6CG-2FFVB900I, XCZU5EV-1FFVC900I, and XCZU5CG-1FFVC900I chips. These chips belong to the Zynq UltraScale+ MPSoC family and offer similar features and capabilities for different performance and power requirements.

• Features

  XCZU6CG-2FFVB1156I is a Zynq UltraScale+ MPSoC with integrated FPGA and ARM processors, featuring 6 ARM Cortex-A53 cores, Mali-400 MP2 GPU, and a programmable logic capacity of 297K logic cells. It also includes 2.4Mb of Block RAM, 60Mb of UltraRAM, and interfaces like PCIe, Gigabit Ethernet, and USB.

• Pinout

  The XCZU6CG-2FFVB1156I is a programmable System on Chip (SoC) with 1156 pins. It features a high-performance processing system, programmable logic, and integrated peripherals for a wide range of applications such as signal processing, networking, and industrial control.

• Manufacturer

  XCZU6CG-2FFVB1156I is manufactured by Xilinx, which is a technology company specializing in the design and production of programmable logic devices. Xilinx is a leading provider of field-programmable gate arrays (FPGAs) and programmable System-on-Chip (SoC) solutions for a wide range of applications in industries such as automotive, aerospace, telecommunications, and data center.

• Application Field

  The XCZU6CG-2FFVB1156I is a versatile SoC device commonly used in applications such as high-performance computing, data center acceleration, networking, and aerospace and defense systems. It is also used in industrial automation, automotive, and telecommunication equipment for its advanced processing capabilities and integrated features.

• Package

  The XCZU6CG-2FFVB1156I chip is packaged in a Flip-Chip Ball Grid Array (FCBGA). It has a form factor of 35mm x 35mm and is in a size of 1156 pins.