Xilinx XCZU7EV-2FFVC1156E

Teilpunkte

• The XCZU7EV-2FFVC1156E chip is a member of the Xilinx Zynq UltraScale+ family, known for its combination of ARM Cortex-A53 processors and programmable logic in a single device. It features a dual-core ARM Cortex-R5 processor, high-performance FPGA fabric, and advanced multimedia capabilities, making it suitable for a wide range of applications in areas such as automotive, industrial, and aerospace.

• Equivalent

  The equivalent products of XCZU7EV-2FFVC1156E chip are Xilinx Zynq UltraScale+ XCZU7EV-2, XCZU7EV-2FFVC900E, and XCZU7EV-2FFVC1156E.

• Features

  - Based on Xilinx Zynq UltraScale+ MPSoC architecture - Features a quad-core ARM Cortex-A53 processor and dual-core ARM Cortex-R5 processor - Includes programmable logic with 93,280 LUTs, 58,160 Flip-flops, and 720 DSP slices - Supports DDR4 memory, PCIe Gen3, Gigabit Ethernet, and USB 3.0 interfaces - Ideal for applications requiring high processing power and flexibility

• Pinout

  XCZU7EV-2FFVC1156E has a pin count of 1156 and is a Zynq UltraScale+ MPSoC device. It features a quad-core Arm Cortex-A53 processor, dual-core Arm Cortex-R5 real-time processor, Mali-400 MP2 GPU, and programmable logic. It is ideal for applications that require high processing power and programmable logic in a single device.

• Manufacturer

  The manufacturer of XCZU7EV-2FFVC1156E is Xilinx. Xilinx is a company that specializes in semiconductor products, including programmable logic devices like field-programmable gate arrays (FPGAs). They provide solutions for various industries such as automotive, aerospace, telecommunications, and data centers, offering advanced technologies for high-performance computing applications.

• Application Field

  The XCZU7EV-2FFVC1156E is a Zynq UltraScale+ MPSoC suitable for a wide range of applications including automotive driver assistance, industrial robotics, machine vision, and 5G wireless communications. Its combination of ARM processing cores and programmable logic make it ideal for applications requiring high performance, flexibility, and low power consumption.

• Package

  The XCZU7EV-2FFVC1156E chip comes in a flip-chip ball grid array (FCBGA) package with a size of 35mm x 35mm and a form factor of 1156-pin.