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$5000H5TQ2G63BFR-11C
High-quality DDR DRAM module for reliable data storage and processing
![ISO14001](/img/about/iso14001.png)
![ISO9001](/img/about/iso9001.png)
![DUNS](/img/about/duns.png)
Marken: SKHYNIX
Herstellerteil #: H5TQ2G63BFR-11C
Datenblatt: H5TQ2G63BFR-11C Datenblatt (PDF)
Paket/Gehäuse: BGA
Produktart: Speicher
RoHS-Status:
Lagerzustand: 7.964 Stück, Neues Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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H5TQ2G63BFR-11C Allgemeine Beschreibung
DescriptionThe H5TQ2G43CFR-xxC, H5TQ2G83CFR-xxC are a 2,147,483,648-bit CMOS Double Data Rate III (DDR3) Synchronous DRAM, ideally suited for the main memory applications which requires large memory density and high bandwidth. SK hynix 2Gb DDR3 SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the clock. While all addresses and control inputs are latched on the rising edges of the CK (falling edges of the CK), Data, Data strobes and Write data masks inputs are sampled on both rising and falling edges of it. The data paths are internally pipelined and 8-bit prefetched to achieve very high bandwidth.FEATURES• VDD=VDDQ=1.5V +/- 0.075V• Fully differential clock inputs (CK, CK) operation• Differential Data Strobe (DQS, DQS)• On chip DLL align DQ, DQS and DQS transition with CK transition• DM masks write data-in at the both rising and falling edges of the data strobe• All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock• Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 12, 13 and 14 supported• Programmable additive latency 0, CL-1, and CL-2 supported• Programmable CAS Write latency (CWL) = 5, 6, 7, 8, 9, 10• Programmable burst length 4/8 with both nibble sequential and interleave mode• BL switch on the fly• 8banks• Average Refresh Cycle (Tcase of0 oC~ 95oC) - 7.8 µs at 0oC ~ 85 oC - 3.9 µs at 85oC ~ 95 oC• JEDEC standard 78ball FBGA(x4/x8)• Driver strength selected by EMRS• Dynamic On Die Termination supported• Asynchronous RESET pin supported• ZQ calibration supported• TDQS (Termination Data Strobe) supported (x8 only)• Write Levelization supported• 8 bit pre-fetch• This product in compliance with the RoHS directive.
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Funktionen
- 1. It has a memory capacity of 2 gigabits (Gb).
- 2. It operates at a clock frequency of 800 MHz (DDR3-800).
- 3. The module interface is 96-ball FBGA (Fine-pitch Ball Grid Array).
- 4. It requires a supply voltage of 1.5 volts.
- 5. It supports burst lengths of 4 and 8.
Anwendung
- DDR3 SDRAM modules like H5TQ2G63BFR-11C are commonly used in computer systems and other electronic devices where high-speed memory access is required. Some typical applications include:
- 1. Personal computers and laptops.
- 2. Servers and workstations.
- 3. Gaming consoles.
- 4. Networking devices.
- 5. Mobile devices like smartphones and tablets.
Spezifikationen
Parameter | Wert | Parameter | Wert |
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Manufacturer | HYNIX |
Versand
Versandart | Versandgebühr | Vorlaufzeit | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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REGISTRIERTE LUFTPOST | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
Bearbeitungszeit: Die Versandkosten hängen von der jeweiligen Zone und dem Land ab.
Zahlung
Zahlungsbedingungen | Handgebühr | |
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Banküberweisung | Bankgebühr in Höhe von 30,00 USD wird berechnet. |
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Paypal | 4,0 % Servicegebühr wird berechnet. |
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Kreditkarte | 3,5 % Servicegebühr wird berechnet. |
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Western Union | charge US.00 banking fee. |
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Geldgramm | Bankgebühr in Höhe von 0,00 USD wird berechnet. |
Garantien
1. Die von Ihnen gekauften elektronischen Bauteile enthalten eine 365-tägige Garantie. Wir garantieren die Produktqualität.
2. Wenn einige der Artikel, die Sie erhalten haben, nicht von perfekter Qualität sind, würden wir verantwortungsvoll Ihre Rückerstattung oder Ersatz arrangieren. Die Artikel müssen jedoch in ihrem Originalzustand verbleiben.
Verpackung
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Schritt1 :Produkt
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Schritt2 :Vakuumverpackung
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Schritt3 :Antistatikbeutel
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Schritt4 :Individuelle Verpackung
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Schritt5 :Verpackungskartons
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Schritt6 :Barcode-Versandetikett
Alle Produkte werden in antistatischen Beuteln verpackt. Versand mit ESD-Antistatikschutz.
Auf dem äußeren ESD-Verpackungsetikett werden die Informationen unseres Unternehmens verwendet: Teilenummer, Marke und Menge.
Wir prüfen alle Waren vor dem Versand, stellen sicher, dass sich alle Produkte in gutem Zustand befinden und dass die Teile neu und original sind und mit dem Datenblatt übereinstimmen.
Nachdem alle Waren darauf überprüft wurden, dass nach dem Verpacken keine Probleme auftreten, werden wir sicher verpacken und per Global Express versenden. Es zeigt eine ausgezeichnete Durchstoß- und Reißfestigkeit sowie eine gute Dichtungsintegrität.
Teilpunkte
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The H5TQ2G63BFR-11C is a 2 Gb DDR2 SDRAM chip designed for use in various electronic devices. It offers high-speed data transfer and low power consumption, making it ideal for applications requiring reliable memory performance. This chip is commonly used in mobile devices, consumer electronics, and networking equipment.
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Equivalent
Some equivalent products of the H5TQ2G63BFR-11C chip include the Micron MT29F2G08ABBEAHC-IT:D and the Samsung K4B2G0846B-BCK0 chips. These chips have similar specifications and performance characteristics, making them suitable alternatives for various electronic applications. -
Features
1. 2GB LPDDR2 SDRAM 2. 8-bit prefetch 3. High-speed operation: 333MHz (DDR667) 4. Low-voltage operation: 1.8V/1.8V 5. Fully synchronous; all signals referenced to a positive clock edge 6. Internal banks for concurrent operation 7. Data mask(DQM) 8. Single Data Rate architecture; two data transfers per clock cycle -
Pinout
The H5TQ2G63BFR-11C has a 168-ball FBGA package with a x16 interface. It is a 2Gb LPDDR3 SDRAM with a speed of 1600Mbps. The functions of this memory chip include providing high-speed data storage for mobile devices and low-power consumption during operation. -
Manufacturer
The manufacturer of the H5TQ2G63BFR-11C is SK Hynix. SK Hynix is a South Korean multinational semiconductor company specializing in memory chips. They produce a wide range of memory products including DRAM, NAND flash, and SSDs for various applications such as smartphones, computers, and servers. -
Application Field
The H5TQ2G63BFR-11C is commonly used in applications requiring high-speed random access memory such as smartphones, tablets, digital cameras, and other portable electronic devices. It is designed for high-performance computing tasks and is well-suited for applications that require low power consumption and high memory bandwidth. -
Package
The H5TQ2G63BFR-11C chip is in a BGA package with 169-ball form. It has a size of 14mm by 18mm.
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