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$5000H5TQ4G63MFR-PBC
Reliable and efficient memory component for industrial control systems
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Marken: Sk Hynix Inc
Herstellerteil #: H5TQ4G63MFR-PBC
Datenblatt: H5TQ4G63MFR-PBC Datenblatt (PDF)
Paket/Gehäuse: FBGA-96
Produktart: Speicher
RoHS-Status:
Lagerzustand: 5.419 Stück, Neues Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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H5TQ4G63MFR-PBC Allgemeine Beschreibung
SK Hynix's H5TQ4G63MFR-PBC mobile DRAM module is a game-changer in the world of high-speed memory solutions for portable devices. With its 4-gigabit LPDDR4X SDRAM chip, this module offers unparalleled data rates of 4266 Mbps, setting a new benchmark for performance in smartphones, tablets, and other mobile gadgets. Operating at a low voltage of 1.1V, this chip strikes the perfect balance between power and efficiency, making it an ideal choice for battery-powered devices. The programmable CAS latency of 17 ensures rapid data access, while the burst length of 8 further enhances speed and responsiveness. Housed in a compact 96-ball FBGA package with a temperature range of -25°C to 85°C, this module is versatile and reliable, guaranteeing exceptional performance in all conditions
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Funktionen
Anwendung
- High-density mobile DDR2 SDRAM
Spezifikationen
Parameter | Wert | Parameter | Wert |
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Rohs Code | Yes | Part Life Cycle Code | Obsolete |
Ihs Manufacturer | SK HYNIX INC | Part Package Code | BGA |
Package Description | TFBGA, BGA96,9X16,32 | Pin Count | 96 |
Reach Compliance Code | compliant | ECCN Code | EAR99 |
HTS Code | 8542.32.00.36 | Access Mode | MULTI BANK PAGE BURST |
Access Time-Max | 0.225 ns | Additional Feature | AUTO/SELF REFRESH |
Clock Frequency-Max (fCLK) | 800 MHz | I/O Type | COMMON |
Interleaved Burst Length | 4,8 | JESD-30 Code | R-PBGA-B96 |
JESD-609 Code | e1 | Length | 13 mm |
Memory Density | 4294967296 bit | Memory IC Type | DDR3 DRAM |
Memory Width | 16 | Number of Functions | 1 |
Number of Ports | 1 | Number of Terminals | 96 |
Number of Words | 268435456 words | Number of Words Code | 256000000 |
Operating Mode | SYNCHRONOUS | Operating Temperature-Max | 85 °C |
Organization | 256MX16 | Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY | Package Code | TFBGA |
Package Equivalence Code | BGA96,9X16,32 | Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | 260 |
Power Supplies | 1.5 V | Qualification Status | Not Qualified |
Refresh Cycles | 8192 | Seated Height-Max | 1.2 mm |
Self Refresh | YES | Sequential Burst Length | 4,8 |
Standby Current-Max | 0.02 A | Supply Current-Max | 0.29 mA |
Supply Voltage-Max (Vsup) | 1.575 V | Supply Voltage-Min (Vsup) | 1.425 V |
Supply Voltage-Nom (Vsup) | 1.5 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | OTHER |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | Terminal Form | BALL |
Terminal Pitch | 0.8 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 20 |
Versand
Versandart | Versandgebühr | Vorlaufzeit | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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REGISTRIERTE LUFTPOST | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
Bearbeitungszeit: Die Versandkosten hängen von der jeweiligen Zone und dem Land ab.
Zahlung
Zahlungsbedingungen | Handgebühr | |
---|---|---|
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Banküberweisung | Bankgebühr in Höhe von 30,00 USD wird berechnet. |
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Paypal | 4,0 % Servicegebühr wird berechnet. |
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Kreditkarte | 3,5 % Servicegebühr wird berechnet. |
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Western Union | charge US.00 banking fee. |
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Geldgramm | Bankgebühr in Höhe von 0,00 USD wird berechnet. |
Garantien
1. Die von Ihnen gekauften elektronischen Bauteile enthalten eine 365-tägige Garantie. Wir garantieren die Produktqualität.
2. Wenn einige der Artikel, die Sie erhalten haben, nicht von perfekter Qualität sind, würden wir verantwortungsvoll Ihre Rückerstattung oder Ersatz arrangieren. Die Artikel müssen jedoch in ihrem Originalzustand verbleiben.
Verpackung
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Schritt1 :Produkt
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Schritt2 :Vakuumverpackung
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Schritt3 :Antistatikbeutel
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Schritt4 :Individuelle Verpackung
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Schritt5 :Verpackungskartons
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Schritt6 :Barcode-Versandetikett
Alle Produkte werden in antistatischen Beuteln verpackt. Versand mit ESD-Antistatikschutz.
Auf dem äußeren ESD-Verpackungsetikett werden die Informationen unseres Unternehmens verwendet: Teilenummer, Marke und Menge.
Wir prüfen alle Waren vor dem Versand, stellen sicher, dass sich alle Produkte in gutem Zustand befinden und dass die Teile neu und original sind und mit dem Datenblatt übereinstimmen.
Nachdem alle Waren darauf überprüft wurden, dass nach dem Verpacken keine Probleme auftreten, werden wir sicher verpacken und per Global Express versenden. Es zeigt eine ausgezeichnete Durchstoß- und Reißfestigkeit sowie eine gute Dichtungsintegrität.
Teilpunkte
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The H5TQ4G63MFR-PBC chip is a high-performance memory module commonly used in mobile devices such as smartphones and tablets. It offers fast data storage and retrieval capabilities, making it ideal for applications that require high-speed processing. With a compact form factor and reliable performance, it is a popular choice for manufacturers looking to improve the performance of their devices.
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Equivalent
Some equivalent products of the H5TQ4G63MFR-PBC chip are the MT47H64M16HR-25E:H, K4F4E304HB-MGCH, and AS4C128M16D3L-12BCN. These chips all have similar specifications and features, making them suitable alternatives for the H5TQ4G63MFR-PBC chip in various applications. -
Features
H5TQ4G63MFR-PBC is a high-speed, low-power DDR4 SDRAM memory module. It boasts a capacity of 4GB and operates at a speed of 3200 Mbps. With a compact form factor and high data transfer rates, it is ideal for use in various computing and mobile devices. -
Pinout
The H5TQ4G63MFR-PBC is a 144-pin mobile DRAM chip that features 4Gb of memory. The pin count refers to the number of physical pins on the chip for connecting to a circuit board, while the function is to provide high-speed random access memory for mobile devices. -
Manufacturer
The manufacturer of the H5TQ4G63MFR-PBC is SK Hynix. SK Hynix is a South Korean multinational corporation that specializes in the production of memory semiconductors, including DRAM, NAND Flash, and CMOS Image Sensors. Founded in 1983, SK Hynix is one of the largest memory chip makers in the world and serves a wide range of industries, including consumer electronics, telecommunications, and automotive. -
Application Field
The H5TQ4G63MFR-PBC is commonly used in mobile devices such as smartphones and tablets for high-performance memory storage and data processing. It is also suitable for use in automotive applications, industrial devices, and other embedded systems that require fast and reliable memory performance in a compact form factor. -
Package
The H5TQ4G63MFR-PBC chip is a 64-Gigabit (4 Gigabyte) DDR3 SDRAM manufactured by Hynix. It comes in a 96-ball FBGA package and has a form factor of 13.5mm x 21.5mm. The chip size is 4GB.
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