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$5000
RC28F00AP30TFA
EASYBGA-64(8x10) NOR flash memory module with 64 pins, designed for RoHS compliance and easy installation
![ISO14001](/img/about/iso14001.png)
![ISO9001](/img/about/iso9001.png)
![DUNS](/img/about/duns.png)
Marken: MICRON TECHNOLOGY INC
Herstellerteil #: RC28F00AP30TFA
Datenblatt: RC28F00AP30TFA Datenblatt (PDF)
Paket/Gehäuse: 64-EasyBGA (8x10)
RoHS-Status:
Lagerzustand: 6.554 Stück, Neues Original
Produktart: Speicher
Warranty: 1 Year Ovaga Warranty - Find Out More
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*Alle Preise sind in USD
Menge | Einzelpreis | Ext. Preis |
---|---|---|
1 | $30,760 | $30,760 |
200 | $12,274 | $2454,800 |
500 | $11,863 | $5931,500 |
1000 | $11,661 | $11661,000 |
Auf Lager: 6.554 Stck
RC28F00AP30TFA Allgemeine Beschreibung
Distinguished by its sector architecture, the RC28F00AP30TFA facilitates flexible block erasure, accommodating both uniform and non-uniform block sizes with ease. Its prowess extends to performance, offering rapid read and write speeds that are paramount for applications necessitating prompt data access
Funktionen
- Architecture
- — Symmetrical 128-Kbyte blocks
- — 256 Mbit (256 blocks)
- — 128 Mbit (128 blocks)
- — 64 Mbit (64 blocks)
- — 32 Mbit (32 blocks)
- Performance
- — 75 ns Initial Access Speed (32,64,128 Mbit densities)
- — 95 ns Initial Access Speed (256Mbit only)
- — 25 ns 8-word and 4-word Asynchronous page-mode reads
- — 32-Byte Write buffer; 4 µs per Byte Effective programming time
- System Voltage
- — VCC = 2.7 V to 3.6 V
- — VCCQ = 2.7 V to 3.6 V
- Packaging
- — 56-Lead TSOP (32, 64, 128, 256 Mbit)
- — 64-Ball Numonyx Easy BGA package (32, 64, 128 and 256 Mbit)
- Security
- — Enhanced security options for code protection
- — 128-bit Protection Register: 64-bits Unique device identifier bits 64-bits User-programmable OTP bits
- — Absolute protection with VPEN = GND
- — Individual block locking
- — Block erase/program lockout during power transitions
- Software
- — Program and erase suspend support
- — Flash Data Integrator (FDI), Common Flash Interface (CFI) Compatible
- Quality and Reliability
- — Operating temperature: -40 °C to +85 °C
- — 100K Minimum erase cycles per block
- — 0.13 µm ETOX™ VIII Process technology
Spezifikationen
Parameter | Wert | Parameter | Wert |
---|---|---|---|
Pbfree Code | No | Rohs Code | No |
Part Life Cycle Code | Obsolete | Ihs Manufacturer | MICRON TECHNOLOGY INC |
Part Package Code | BGA | Package Description | BGA-64 |
Pin Count | 64 | Reach Compliance Code | |
ECCN Code | EAR99 | HTS Code | 8542.32.00.51 |
Access Time-Max | 100 ns | Additional Feature | TOP BOOT |
Boot Block | TOP | Command User Interface | YES |
Common Flash Interface | YES | Data Polling | NO |
JESD-30 Code | R-PBGA-B64 | JESD-609 Code | e1 |
Length | 10 mm | Memory Density | 1073741824 bit |
Memory IC Type | FLASH | Memory Width | 16 |
Number of Functions | 1 | Number of Sectors/Size | 4,1023 |
Number of Terminals | 64 | Number of Words | 67108864 words |
Number of Words Code | 64000000 | Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
Organization | 64MX16 | Package Body Material | PLASTIC/EPOXY |
Package Code | TBGA | Package Equivalence Code | BGA64,8X8,40 |
Package Shape | RECTANGULAR | Package Style | GRID ARRAY, THIN PROFILE |
Page Size | 16 words | Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | 235 | Power Supplies | 1.8,1.8/3.3 V |
Programming Voltage | 3 V | Qualification Status | Not Qualified |
Seated Height-Max | 1.2 mm | Sector Size | 16K,64K |
Standby Current-Max | 0.00024 A | Supply Current-Max | 0.031 mA |
Supply Voltage-Max (Vsup) | 2 V | Supply Voltage-Min (Vsup) | 1.7 V |
Supply Voltage-Nom (Vsup) | 1.8 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN SILVER COPPER | Terminal Form | BALL |
Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 | Toggle Bit | NO |
Type | NOR TYPE |
Versand
Versandart | Versandgebühr | Vorlaufzeit | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
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REGISTRIERTE LUFTPOST | $20.00-$40.00 (0.50 KG) | 2-5 Tage |
Bearbeitungszeit: Die Versandkosten hängen von der jeweiligen Zone und dem Land ab.
Zahlung
Zahlungsbedingungen | Handgebühr | |
---|---|---|
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Banküberweisung | Bankgebühr in Höhe von 30,00 USD wird berechnet. |
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Paypal | 4,0 % Servicegebühr wird berechnet. |
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Kreditkarte | 3,5 % Servicegebühr wird berechnet. |
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Western Union | charge US.00 banking fee. |
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Geldgramm | Bankgebühr in Höhe von 0,00 USD wird berechnet. |
Garantien
1. Die von Ihnen gekauften elektronischen Bauteile enthalten eine 365-tägige Garantie. Wir garantieren die Produktqualität.
2. Wenn einige der Artikel, die Sie erhalten haben, nicht von perfekter Qualität sind, würden wir verantwortungsvoll Ihre Rückerstattung oder Ersatz arrangieren. Die Artikel müssen jedoch in ihrem Originalzustand verbleiben.
Verpackung
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Schritt1 :Produkt
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Schritt2 :Vakuumverpackung
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Schritt3 :Antistatikbeutel
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Schritt4 :Individuelle Verpackung
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Schritt5 :Verpackungskartons
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Schritt6 :Barcode-Versandetikett
Alle Produkte werden in antistatischen Beuteln verpackt. Versand mit ESD-Antistatikschutz.
Auf dem äußeren ESD-Verpackungsetikett werden die Informationen unseres Unternehmens verwendet: Teilenummer, Marke und Menge.
Wir prüfen alle Waren vor dem Versand, stellen sicher, dass sich alle Produkte in gutem Zustand befinden und dass die Teile neu und original sind und mit dem Datenblatt übereinstimmen.
Nachdem alle Waren darauf überprüft wurden, dass nach dem Verpacken keine Probleme auftreten, werden wir sicher verpacken und per Global Express versenden. Es zeigt eine ausgezeichnete Durchstoß- und Reißfestigkeit sowie eine gute Dichtungsintegrität.
Teilpunkte
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The RC28F00AP30TFA chip is a flash memory chip manufactured by Intel. It offers 3V operation with a capacity of 128Mb to meet various storage needs. The chip also features a fast read and program speed, making it suitable for applications requiring high performance and reliability.
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Equivalent
The equivalent products of the RC28F00AP30TFA chip are the Intel 28F008SA, 28F008B3T, and 28F008S5 chips. These are all high-performance 3V Flash Memory chips with similar specifications and features. -
Features
- 32MB Flash Memory - x16 Interface - 3V Supply Voltage - 100ns Access Time - Industrial Temperature Range (-40°C to 85°C) - Low Power Consumption - ETOPIA Architecture - Hardware-Based Asynchronous Reset - Advanced Command Set and Lock Register - Lockable Boot Block - Extended Block Erase Times - 100,000 Erase/Write Cycles. -
Pinout
The RC28F00AP30TFA is a 44-pin BGA flash memory chip produced by Intel. It functions as a 32Mb (4MB) Parallel NOR Flash Memory. -
Manufacturer
The manufacturer of the RC28F00AP30TFA is Intel Corporation. Intel Corporation is an American multinational technology company that designs and manufactures semiconductor chips and other technologies used in computers and electronic devices. They are one of the world's largest and highest-valued semiconductor chip makers. -
Application Field
The RC28F00AP30TFA is commonly used in automotive, industrial, and consumer electronics applications that require high-performance, low-power, and high-density flash memory storage solutions. It is suitable for applications such as infotainment systems, navigation systems, industrial control systems, and smart home devices. -
Package
The RC28F00AP30TFA chip is a BGA (Ball Grid Array) package type, with a size of 10 x 18 mm, and a total of 100 balls. It is a Flash Memory chip in a compact and soldered form factor suitable for various electronic devices.
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Niedrigste internationale Versandgebühr beginnt ab 0,00 USD
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